Review Performance and Technology Trends 1000 CS152 Computer Architecture and Engineering Lecture 4 Supercomputers Performance 100 Mainframes 10 Minicomputers Microprocessors 1 Cost and Design 0 1 1965 lecture slides http www inst eecs berkeley edu cs152 CS152 Kubiatowicz Lec4 1 CMOS Technology Trends 1990 1995 2000 2 3 99 Shorter design cycle fully exploit the advancing technology 3yr Advanced branch prediction and pipeline techniques Bigger and more sophisticated on chip caches CS152 Kubiatowicz UCB Spring 1999 Lec4 2 Overview Cost and Design Review from Last Lecture 2 minutes Complementary PMOS and NMOS transistors CMOS inverter and CMOS logic gates Cost and Price 18 Administrative Matters 3 minutes Delay Modeling and Gate Characterization Delay Internal Delay Load Dependent Delay x Output Load Clocking Methodology and Timing Considerations Simplest clocking methodology All storage elements use the SAME clock edge Cycle Time CLK to Q Longest Delay Path Setup Clock Skew CLK to Q Shortest Delay Path Clock Skew Hold Time UCB Spring 1999 1985 Year RISC lesson is to keep the ISA as simple as possible Review Technology Logic Design and Delay 2 3 99 1980 Feature Size shrinks 10 yr Switching speed improves 1 2 yr Density improves 1 2x yr Die Area 1 2x yr John Kubiatowicz http cs berkeley edu kubitron UCB Spring 1999 1975 Technology Power 1 2 x 1 2 x 1 2 1 7 x year Feb 3 1999 2 3 99 1970 CS152 Kubiatowicz Lec4 3 Design process 27 minutes Break 5 minutes More Design process 15 minutes Online notebook 10 minutes 2 3 99 UCB Spring 1999 CS152 Kubiatowicz Lec4 4 Integrated Circuit Costs Die Yield Raw Dice Per Wafer Die cost Wafer cost Dies per Wafer Die yield 6 15cm 8 20cm 10 25cm die area mm2 100 144 196 139 90 62 265 177 124 431 290 206 die yield 23 wafer diameter Dies per wafer Wafer diam 2 2 Wafer diam Test dies Wafer Area Die Area 2 Die Area Die Area 19 256 44 90 153 324 32 68 116 400 23 52 90 16 12 11 10 typical CMOS process 2 wafer yield 90 defect density 2 cm2 4 test sites wafer Die Yield Wafer yield 1 Defects per unit area Die Area 6 15cm 8 20cm 10 25cm Die Cost is goes roughly with the cube of the area 2 3 99 2 3 99 386DX 2 0 90 486DX2 3 0 80 1200 1 0 81 181 54 12 PowerPC 601 4 0 80 1700 1 3 121 115 28 53 1 0 43 360 71 3 0 80 1300 1 0 196 66 27 73 DEC Alpha 3 0 70 1500 1 2 234 53 19 149 SuperSPARC 3 0 70 1700 1 6 256 48 13 272 Pentium 1 5 296 40 9 417 3 0 80 1500 From Estimating IC Manufacturing Costs by Linley Gwennap Microprocessor Report August 2 1993 p 15 UCB Spring 1999 Packaging Cost depends on pins heat dissipation 4 HP PA 7100 2 3 99 IC cost Die cost Testing cost Packaging cost Final test yield Metal Line Wafer Defect Area Dies Yield Die Cost layers width cost cm2 mm2 wafer 900 CS152 Kubiatowicz Lec4 6 UCB Spring 1999 Other Costs Real World Examples Chip 2 5 9 typical cost of an 8 4 metal layers 0 5um CMOS wafer 2000 CS152 Kubiatowicz Lec4 5 UCB Spring 1999 Good Dice Per Wafer Before Testing 31 16 9 5 3 59 32 19 11 7 96 53 32 20 13 CS152 Kubiatowicz Lec4 7 Chip 386DX 486DX2 PowerPC 601 HP PA 7100 DEC Alpha SuperSPARC Pentium 2 3 99 Die cost 4 12 53 73 149 272 417 Package pins type 132 QFP 168 PGA 304 QFP 504 PGA 431 PGA 293 PGA 273 PGA cost 1 11 3 35 30 20 19 UCB Spring 1999 Test Assembly 4 12 21 16 23 34 37 Total 9 35 77 124 202 326 473 CS152 Kubiatowicz Lec4 8 Cost vs Price System Cost 1995 96 Workstation System Subsystem of total cost Cabinet Sheet metal plastic Power supply fans Cables nuts bolts Subtotal 1 2 1 4 Processor DRAM 64MB Video system I O system Printed Circuit board Subtotal 6 36 14 3 1 60 Keyboard mouse Monitor Hard disk 1 GB Tape drive DAT Subtotal 1 22 7 6 36 Motherboard I O Devices 2 3 99 UCB Spring 1999 CS152 Kubiatowicz Lec4 9 Q What of company income on Research and Development R D 50 80 Average Discount 33 45 gross margin 33 14 direct costs direct costs 8 10 component cost component cost 25 31 avg selling price 25 100 Gross Margin 33 Direct Costs Component Cost Input chips displays 2 3 99 Cost Summary component cost Making it labor scrap returns WS PC list price Overhead R D rent marketing profits Commision channel profit volume discounts UCB Spring 1999 CS152 Kubiatowicz Lec4 10 Administrative Matters Review complete did ok on prob 1 4 Problems 2 and 3 more challenging Make sure you look at solutions Integrated circuits driving computer industry Die costs goes up with the cube of die area Read Chapter 4 ALU Multiply Divide FP Mult Economics is the ultimate driver for performance Dollars for bugs First to report bug gets 1 check Send 1 bug email to mkp mkp com Include page number orginal text why bug fixed text 2 3 99 UCB Spring 1999 CS152 Kubiatowicz Lec4 11 2 3 99 UCB Spring 1999 CS152 Kubiatowicz Lec4 12 Design Process cont The Design Process To Design Is To Represent Design Finishes As Assembly Design activity yields description representation of an object Design understood in terms of components and how they have been assembled Traditional craftsman does not distinguish between the conceptualization and the artifact Separation comes about because of complexity CPU Datapath ALU Top Down decomposition of complex functions behaviors into more primitive functions The concept is captured in one or more representation languages This process IS design Regs Control Shifter Nand Gate bottom up composition of primitive building blocks into more complex assemblies Design Begins With Requirements Design is a creative process not a simple method Functional Capabilities what it will do Performance Characteristics Speed Power Area Cost 2 3 99 UCB Spring 1999 CS152 Kubiatowicz Lec4 13 2 3 99 Design Refinement CS152 Kubiatowicz Lec4 14 UCB Spring 1999 Design as Search Informal System Requirement Problem A Initial Specification Strategy 1 Strategy 2 Intermediate Specification SubProb 1 refinement increasing level of detail Final Architectural Description BB1 BB2 SubProb2 SubProb3 BBn BB3 Design involves educated guesses and verification Intermediate Specification of Implementation Given the goals how should these be prioritized Given alternative design pieces which should be selected Given design space of components assemblies which part will yield the best solution Final Internal Specification Feasible good choices vs Optimal choices Physical Implementation 2 3 99 UCB Spring 1999 CS152 Kubiatowicz Lec4 15 2 3 99 UCB Spring 1999 CS152 Kubiatowicz Lec4 16 Problem Design a fast ALU for the MIPS ISA Requirements MIPS ALU requirements Add AddU Sub SubU AddI AddIU
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