1EE141 – Fall 2005Lecture 2Design MetricsDesign MetricsEE141 2Admin Page Everyone should have a UNIX account on Cory! This will allow you to run HSPICE!• If you do not have an account, check: http://www-inst.eecs.berkeley.edu/usr/pub/jpg/How-to-Get-Named-Acct.jpg PC accounts for 353 Cory will be created early next week (when the class list is completed) Discussions & Labs start in Week 3If you have not signed-in on the class roster,please do so after the lecture.2EE141 3Getting Started with HSPICE Run the simulator on your input file: • hspice filename.sp > filename.lis Use the waveform viewer to see the output:• awaves Musts:• Input files must have the extension .sp for the waveform viewer to work• The input file must have “.OPTIONS POST=2” specified Online help:• http://www-inst.berkeley.edu/usr/pub/HSPICE.docs/1992.2/hspice/hspice.pdf (10MB, 1953 pages, do not print!)• “The SPICE Book” by Andrei VladimirescuEE141 4Netlist Format The input files are case insensitive. The first line is always a comment. Other lines are commented with a leading * or $ All nonlinear devices must have a .MODEL statement.• Models of nonlinear elements• Circuit netlist • Control statements• Analysis3EE141 5Also Important Models: ~ee141/MODELS/g25.mod• BJT model for Homework 1: npn.mod• 0.25µm CMOS models: g25.mod Machines to log-in to• {cory, quasar, c199}.eecsEE141 6Last Lecture Last lecture• Moore’s Law• Challenges in digital IC design in the next decade Today’s lecture• Review of Moore’s Law• Design metrics4EE141 7What Happened over 30 Years?42 M transistors1.5 GHz operation1971 20002,300 transistors108 KHz operation~15,000 xComparison (automotive): Travel from San Francisco to New York in 13 sec!EE141 840048008808080858086 (P1)286 (P2)386 (P3)486 (P4)Pentium® (P5)Pentium Pro (P6)0.0010.010.111010010001970 1980 1990 2000 2010YearTransistors (MT)2X growth in 1.96 years!Transistors on Lead Microprocessors double every 2 yearsTransistors on Lead Microprocessors double every 2 yearsMoore’s Law in MicroprocessorsSource:S. Borkar(Intel)Pentium 45EE141 9Pentium (R)Pentium Pro (R) 486386i86011010010001.5µ1.0µ0.8µ0.6µ0.35µ0.25µ0.18µ0.13µLogic Density2x trendLogic Transistors/mm2Pentium II (R) Moore’s Law – Logic Density Shrinks and compactions meet density goals• New micro-architectures drop densitySource: IntelEE141 10Die Size Growth40048008808080858086286386486Pentium ®Pentium Pro1101001970 1980 1990 2000 2010YearDie size (mm)~7% growth per year~2X growth in 10 yearsDie size grows by 14% to satisfy Moore’s LawDie size grows by 14% to satisfy Moore’s LawSource:S. Borkar(Intel)6EE141 11FrequencyPentium ProPentium ®486386286808680858080800840040.11101001000100001970 1980 1990 2000 2010YearFrequency (Mhz)Doubles every2 yearsSource:S. Borkar(Intel)Lead Microprocessor frequency doubles every 2 yearsLead Microprocessor frequency doubles every 2 yearsPentium 4EE141 12Processor Power386386486486Pentium(R)Pentium(R) MMXPentium Pro (R)Pentium II (R)1101001.5µ 1µ 0.8µ 0.6µ 0.35µ 0.25µ 0.18µ 0.13µMax Power (Watts)? Lead processor power increases every generation• Compactions provide higher performance at lower powerSource: Intel7EE141 13Power will be a Problem5KW 18KW 1.5KW 500W 40048008808080858086286386486Pentium ®0.11101001000100001000001971 1974 1978 1985 1992 2000 2004 2008YearPower (Watts)Power delivery and dissipation will be prohibitivePower delivery and dissipation will be prohibitiveSource:S. Borkar(Intel)Pentium ProEE141 14Productivity Trends1101001,00010,000100,0001,000,00010,000,000200319811983198519871989199119931995199719992001200520072009101001,00010,000100,0001,000,00010,000,000100,000,000Logic Tr./ChipTr./Staff Month.xxxxxxx21%/Yr. compoundProductivity growth ratex58%/Yr. compoundedComplexity growth rate10,0001,0001001010.10.010.001Logic Transistor per Chip(M)0.010.11101001,00010,000100,000Productivity(K) Trans./Staff - Mo.ComplexityComplexity outpaces design productivityComplexity outpaces design productivitySource: SematechToday8EE141 15Summary Technology scaling by 0.7 per generation• # of transistors/die doubles every 2 years• can integrate 2x more functions per chip• cost of a function decreases 2x Main problem: power delivery and dissipation How to design more and more complex chips?• Designer productivity does not double every 2 years• Need to understand different levels of abstractionEE141 16n+n+SGD+DEVICECIRCUITGATEMODULESYSTEMDesign Abstraction Levels9EE141 172010 Outlook Performance 2x / 2 years• 1 T instructions/s• 20-30 GHz clock Complexity• No of transistors: 1 Billion• Die area: 40mm x 40mm Power• 10kW!• Leakage: 1/3 of total PowerP. Gelsinger, µProcessors for the New Millennium, ISSCC 2001EE141 18OutlineDesign MetricsDesign Metrics• Cost• Reliability• Speed• Power10EE141 19Cost of Integrated Circuits NRE (Non-Recurrent Engineering) costs – fixed• design time and effort, mask generation− independent of sales volume / number of products− one-time cost factor• indirect costs (the company overhead)− R&D, manufacturing equipment etc. Recurrent costs – variable• silicon processing, packaging, test− proportional to volume− proportional to chip areaEE141 20NRE Cost is Increasing11EE141 21Total Cost Cost per IC Variable costvolumecost fixed ICper cost variable ICper cost +=yield test finalpackaging ofcost test die ofcost die ofcost cost variable++=EE141 22Die CostSingle dieWaferGoing up to 12” (30cm)yield die*per wafer dies waferofcost die ofcost =From: http://www.amd.com12EE141 23Yield%100per wafer chips ofnumber Totalper wafer chips good ofNumber ×=Yyield Dieper wafer DiescostWafer cost Die×=()area die2diameterwafer area diediameter/2wafer per wafer Dies2××π−×π=EE141 24Defectsα−α×+=area dieareaunit per defects1yield dieα≈3, complexity of mfg. processdefects per unit area = 0.5 to 1 /cm2cost of die = f (die area)413EE141 25Some Examples (1994)$4179%402961.5$15000.803Pentium$27213%482561.6$17000.703Super Sparc$14919%532341.2$15000.703DEC Alpha$7327%661961.0$13000.803HP PA 7100$5328%1151211.3$17000.804Power PC 601$1254%181811.0$12000.803486 DX2$471%360431.0$9000.902386DXDie costYieldDies/waferArea mm2Def./ cm2Wafer costLine widthMetal layersChipyield Dieper wafer DiescostWafer cost Die×=EE141 26Cost per
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