CS 61C L01 Introduction (1) Wawrzynek Spring 2006 © UCB1/18/2006John Wawrzynek(Warznek)(www.cs.berkeley.edu/~johnw)www-inst.eecs.berkeley.edu/~cs61c/CS61C – Machine StructuresLecture 1 – IntroductionCS 61C L01 Introduction (2) Wawrzynek Spring 2006 © UCB61CWhat are “Machine Structures”?*Coordination of manylevels (layers) of abstractionI/O systemProcessorCompilerOperatingSystem(Windows 2K)Application (ex: browser)Digital DesignCircuit DesignInstruction Set ArchitectureDatapath & Control transistorsMemoryHardwareSoftwareAssemblerCS 61C L01 Introduction (3) Wawrzynek Spring 2006 © UCB61C Levels of Representation (abstractions)High Level LanguageProgram (e.g., C)Assembly LanguageProgram (e.g.,MIPS)Machine LanguageProgram (MIPS)Hardware Architecture Description(e.g., block diagrams)CompilerAssemblerMachineInterpretationtemp = v[k];v[k] = v[k+1];v[k+1] = temp;lw $t0, 0($2)lw $t1, 4($2)sw $t1, 0($2)sw $t0, 4($2)0000 1001 1100 0110 1010 1111 0101 10001010 1111 0101 1000 0000 1001 1100 0110 1100 0110 1010 1111 0101 1000 0000 1001 0101 1000 0000 1001 1100 0110 1010 1111 Logic Circuit Description(Circuit Schematic Diagrams)ArchitectureImplementationRegister FileALUCS 61C L01 Introduction (4) Wawrzynek Spring 2006 © UCBAnatomy: 5 components of any ComputerPersonal Computer Processor ComputerControl(“brain”)Datapath(“brawn”)Memory(where programs, data live whenrunning)DevicesInputOutputKeyboard, MouseDisplay, PrinterDisk(whereprograms,datalive whennot running)CS 61C L01 Introduction (5) Wawrzynek Spring 2006 © UCBOverview of Physical Implementations Integrated Circuits (ICs) Combinational logic circuits, memory elements,analog interfaces. Printed Circuits (PC) boards substrate for ICs and interconnection, distribution ofCLK, Vdd, and GND signals, heat dissipation. Power Supplies Converts line AC voltage to regulated DC low voltagelevels. Chassis (rack, card case, ...) holds boards, power supply, provides physicalinterface to user or other systems. Connectors and Cables.The hardware out of which we make systems.CS 61C L01 Introduction (6) Wawrzynek Spring 2006 © UCBIntegrated Circuits (2005 state-of-the-art) Primarily Crystalline Silicon 1mm - 25mm on a side 2005 - feature size ~ 90nm = 90 x 10-9 m 100 - 1000M transistors (25 - 100M “logic gates") 3 - 10 conductive layers “CMOS” (complementary metal oxidesemiconductor) - most common. Package provides: spreading of chip-level signal paths toboard-level heat dissipation. Ceramic or plastic with gold wires.Chip in PackageBare DieCS 61C L01 Introduction (7) Wawrzynek Spring 2006 © UCBPrinted Circuit Boards fiberglass or ceramic 1-20 conductivelayers 1-20in on a side IC packages aresoldered down. Provides: Mechanical support Distribution of powerand heat.CS 61C L01 Introduction (8) Wawrzynek Spring 2006 © UCBTechnology Trends: Memory Capacity(Single-Chip DRAM)sizeYearBits10001000010000010000001000000010000000010000000001970 1975 1980 1985 1990 1995 2000year size (Mbit)1980 0.06251983 0.251986 11989 41992 161996 641998 1282000 2562002 5122004 1024• Now 1.4X/yr, or 2X every 2 years.• 8000X since 1980!CS 61C L01 Introduction (9) Wawrzynek Spring 2006 © UCBTechnology Trends: Microprocessor Complexity2X transistors/ChipEvery 2 yearsCalled “Moore’s Law” CS 61C L01 Introduction (10) Wawrzynek Spring 2006 © UCB1101001000100001978 1980 1982 1984 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006Performance (vs. VAX-11/780) 25%/year52%/year20%/yearProcessor Performance (SPECint)• VAX : 25%/year 1978 to 1986• RISC + x86: 52%/year 1986 to 2002• RISC + x86: 20%/year 2002 to presentCS 61C L01 Introduction (11) Wawrzynek Spring 2006 © UCBComputer Technology - Dramatic Change!Processor2X in speed every 1.5 years (since ‘85);100X performance in last decade.MemoryDRAM capacity: 2x / 2 years (since ‘96);64x size improvement in last decade.DiskCapacity: 2X / 1 year (since ‘97)250X size in last decade.Will these trends continue?CS 61C L01 Introduction (12) Wawrzynek Spring 2006 © UCBTechnology Trends - what’s next?CS 61C L01 Introduction (13) Wawrzynek Spring 2006 © UCBCS61C: So what's in it for me? Learn some of the big ideas in CS & engineering: Principle of abstraction, used to build systems aslayers 5 Classic components of a Computer Data can be anything (integers, floating point,characters): a program determines what it is Stored program concept: instructions just data Principle of Locality, exploited via a memory hierarchy(cache) Greater performance by exploiting parallelism Principles/Pitfalls of Performance MeasurementCS 61C L01 Introduction (14) Wawrzynek Spring 2006 © UCBOthers Skills learned in 61CLearning C If you know one, you should be able to learn anotherprogramming language largely on your own. Given that you know C++ or Java, should be easy topick up their ancestor, C.Assembly Language Programming This is a skill you will pick up, as a side effect ofunderstanding the Big Ideas.Hardware design We learn just the basics hardware design. CS 150, 152 teach this in more detail.CS 61C L01 Introduction (15) Wawrzynek Spring 2006 © UCBCourse Topic Outline Number representations C-Language (basics + pointers) Storage management Assembly Programming Floating Point Compilation, Assembly Logic Circuit Design CPU organization Pipelining Caches Virtual Memory Performance I/O Interrupts Disks, Networks Advanced TopicsCS 61C L01 Introduction (16) Wawrzynek Spring 2006 © UCBTextsRequired: Computer Organizationand Design: The Hardware/SoftwareInterface, Third Edition, Pattersonand Hennessy (COD). The secondedition is not suggested.Required: The C ProgrammingLanguage, Kernighan and Ritchie(K&R), 2nd editionReading assignments on web pageRead P&H Chapter 1 and sections 3.1 & 3.2 as soon aspossible this week, and K&R Chapters 1-4 before Monday.CS 61C L01 Introduction (17) Wawrzynek Spring 2006 © UCBClass MeetingsMonday LectureDiscussion Session (1 hour), Mon.,Tue., or Wed.Wednesday LectureLab Session (2 hours), Wed., Thur., orFri.Friday LectureThere IS lab this week…CS 61C L01 Introduction (18) Wawrzynek Spring 2006 © UCBHomework, Labs and ProjectsLab exercises (every week)Homework exercises (every week)Due
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