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Berkeley ELENG 105 - Lecture 2 Semiconductor Basics

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EE105 - Spring 2007 Microelectronic Devices and CircuitsPeriodic Table of ElementsElectronic Properties of SiliconThe Diamond StructureStates of an AtomSiliconElectron-Hole Pair InteractionFree Electron Density as a Function of TemperatureN Type DopingP Type DopingSummary of Charge CarriersThermal Equilibrium (Pure Si)Mass Action LawCompensated DopingFirst Charge Transportation Mechanism: DriftMobility vs. Doping in Silicon at 300KCurrent Flow: General CaseCurrent Flow: DriftVelocity SaturationSecond Charge Transportation Mechanism: DiffusionCurrent Flow: DiffusionExample: Linear vs. Nonlinear Charge Density ProfileEinstein's RelationResistivity of Uniformly Doped SiSheet Resistance (Rs)Using Sheet Resistance (Rs)IdealizationsEE105 - Spring 2007Microelectronic Devices and CircuitsLecture 2Semiconductor Basics2Periodic Table of Elements3Electronic Properties of SiliconSilicon is in Group IV (atomic number 14)–Atom electronic structure: 1s22s22p63s23p2–Crystal electronic structure: 1s22s22p63(sp)4–Diamond lattice, with 0.235 nm bond lengthVery poor conductor at room temperature: why?(1s)2(2s)2(2p)6(3sp)4Hybridized State4The Diamond Structure3sp Tetrahedral BondA43.5A35.25States of an AtomQuantum Mechanics: The allowed energy levels for an atom are discrete (2 electrons with opposite spin can occupy a state)When atoms are brought into close contact, these energy levels splitIf there are a large number of atoms, the discrete energy levels form a “continuous” bandEnergyE1E2...E3Forbidden Band GapAllowedEnergyLevelsLattice ConstantAtomic Spacing6SiliconSi has four valence electrons. Therefore, it can form covalent bonds with four of its neighbors. When temperature goes up, electrons in the covalent bond can become free.7Electron-Hole Pair InteractionWith free electrons breaking off covalent bonds, holes are generated.Holes can be filled by absorbing other free electrons, so effectively there is a flow of charge carriers.8Free Electron Density as a Function of Temperature Eg, or bandgap energy, determines how much effort is needed to break off an electron from its covalent bond.There exists an exponential relationship between the free-electron density and bandgap energy.15 3/ 2 320 10 30 15 35.2 10 /( 300 ) 1.08 10 /( 600 ) 1.54 10 / gEkTiiin T e electrons cmn T K electrons cmn T K electrons cm-= �= = �= = �9N Type DopingIf Si is doped with group-V elements such as phosphorous (P) or arsenic (As), then it has more electrons and becomes N type (electron). Group-V impurities are called Donors10P Type DopingIf Si is doped with group-III elements such as boron (B), then it has more holes and becomes P type. Group-III impurities are called Acceptors11Summary of Charge Carriers12Thermal Equilibrium (Pure Si)Balance between generation and recombination determines no = poStrong function of temperature: T = 300 K210( )( )( ) ( )( ) / ( )( ) 10-3 cm at 300Kth optthth iiG G T GR k n pG Rk n p G Tn p G T k n Tn T= += �=� =� = =@13Majority Carrier Conc.= Doping Conc.Minority Carrier Conc.(Mass Action Law)N-TypeP-TypeMass Action LawThe product of electron and hole densities is ALWAYS equal to the square of intrinsic electron density, regardless of doping levels2 10 3( 300 , 10 ) K cmo o i ip n n T n-� = = =ddNNn 0aaNNp 020idnpN@20iannN@14Compensated DopingSi is doped with both donor and acceptor atoms:–More donors than acceptors: Nd > Na  N type–More acceptors than donors: Na > Nd  P type22 iio d a od ao a d oa dnn N N pN Nnp N N nN N= - =-= - =-15First Charge Transportation Mechanism: DriftThe process in which charge particles move because of an electric field is called drift. Charge particles will move at a velocity that is proportional to the electric field.EvEvnephMobility16Mobility vs. Doping in Silicon at 300KTypical values135045022 V-sec / cm V-sec / cmnpmm==17Current Flow: General CaseElectric current is calculated as the amount of charge in v meters that passes thru a cross-section if the charge travel with a velocity of v m/s. I v W h n qIJ v n qWh=- � ���= =- ��18( )n np ptot n pn pJ E n qJ E p qJ E n q E p qq n p Emmm mm m= ��= ��= ��+ ��= +Current Flow: DriftSince velocity is equal to E, drift characteristic is obtained by substituting v with E in the general current equation.The total current density consists of both electrons and holes.19Velocity SaturationA topic treated in more advanced courses is velocity saturation.In reality, velocity does not increase linearly with electric field. It will eventually saturate to a critical value.000011satsatbEvbv EEvmmmmm=+==+20Second Charge Transportation Mechanism: DiffusionCharge particles move from a region of high concentration to a region of low concentration.21Current Flow: DiffusionDiffusion current is proportional to the gradient of charge (dn/dx) along the direction of current flow. Total diffusion current density consists of both electrons and holes.( )n np ptot n pdnJ qDdxdpJ qDdxdn dpJ q D Ddx dx==-= -Diffusion Coefficient22Example: Linear vs. Nonlinear Charge Density ProfileLinear charge density profile means constant diffusion current, whereas nonlinear charge density profile means varying diffusion current. LNqDdxdnqDJnnnddnnLxLNqDdxdnqDJ exp23Einstein's RelationWhile the underlying physics behind drift and diffusion currents are totally different, Einstein’s relation provides a link between the two.pqkTD24Resistivity of Uniformly Doped Si1 1n nnnJ E n q Enqnqm ss mrs m= ��= �== =1 Ohm's LawV R IV E LI J tWI V EL LJ E EA RtW RtW RtWL LRtW tWsrs= �= �= �� �= = = = =� �� �= =25Sheet Resistance (Rs)IC resistors have a specified thickness – not under the control of the circuit designerEliminate thickness, t, by absorbing it into a new parameter: the sheet resistance (Rs)SL L LR RWt t W Wrr� �� � � �= = =� �� � � �� �� � � �“Number of Squares”26Using Sheet Resistance (Rs)Ion-implanted (or “diffused”) IC resistor27IdealizationsWhy does current density Jn “turn”?What is the thickness of the resistor?What is the effect of the contact


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Berkeley ELENG 105 - Lecture 2 Semiconductor Basics

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