EE 143 MICROFABRICATION TECHNOLOGY SPRING 2010 COURSE INFORMATION Instructor Professor Clark Nguyen 574 Cory Hall Tel 510 642 6251 E mail ctnguyen eecs berkeley edu Office Hours M 10 30 12 noon Th 9 10 30 a m in 574 Cory Teaching Assistants TA s Head TA Mr Wei Chang Li 373 Cory Hall Tel 510 643 9825 E mail wcli eecs berkeley edu Office Hours TuTh 4 30 6 p m in 571 Cory Hall tentative Mr Yenhao Chen 373 Cory Hall Tel 510 684 7774 E mail yenhaochen berkeley edu Mr Jaewon Jang 550 Sutardja Dai Hall Tel 510 828 6828 E mail jaewon eecs berkeley edu Mr Jack Yaung 550 Sutardja Dai Hall Tel 510 710 0543 E mail jack eecs berkeley edu Lecture Tuesday Thursday 2 3 30 p m in 3108 Etcheverry Laboratory Sections which might need to change Section 101 Monday 2 5 p m in 218 Cory Section 102 Tuesday 10 1 p m in 218 Cory Section 103 Wednesday 9 12 noon in 218 Cory Section 106 Wednesday 1 4 p m in 218 Cory Section 104 Thursday 11 2 p m in 218 Cory Section 105 Friday 9 12 noon in 218 Cory Office Hours Office hours are the primary mechanism for individual contact with Professor Nguyen and the head TA Mr Wei Chang Li You will also have a chance to query your lab TA s during lab hours All students are strongly encouraged to make use of office and lab hours Course Description Integration density and performance of digital and analog integrated circuits have undergone an astounding revolution in the last few decades Over this time period clock frequencies of microprocessors have doubled every three years and for both logic IC s and memories integration complexity and density has doubled every 1 to 2 years Although innovative circuit and system design can account EE 143 MICROFABRICATION TECHNOLOGY SPRING 2010 for some of these performance increases technology has been the main driving force This course will examine the basic microfabrication process technologies that have enabled the integrated circuit revolution and investigate newer technologies and layout circuit techniques aimed at expanding this revolution to other domains such as microelectromechanical systems MEMS and beyond The goal is to first impart a working knowledge of the methods and processes by which micro and nano devices are constructed and then teach approaches for combining such methods into process sequences that yield arbitrary devices Although the emphasis in this course is on transistor devices in order to leverage material in prerequisite courses many of the methods to be taught are also applicable to MEMS and other micro devices and some attention will be directed towards issues and aspects pertinent to MEMS devices There will be two 1 5 hour lectures per week The lectures will be supplemented by reading assignments indicated on the COURSE SYLLABUS additional reading material to be distributed throughout the course problem sets one per week occasionally per two weeks one midterm exam labs and a final exam Although the material covered in the lectures and in the reading is fundamentally the same the perspectives differ and you are all strongly encouraged to both attend the lectures and complete your reading assignments Furthermore there will be occasional announcements in lectures that will affect your problem sets and exams Lectures and laboratory 4 units Prerequisites The prerequisites for this course are Physics 7B and EE 40 It is assumed that you are familiar with the following topics Fundamentals of materials including crystalline versus amorphous structure and the characteristics of semiconductors insulators and conductors Basic chemistry Elementary semiconductor physics and device operation for pn junctions and MOS field effect transistors MOSFETs Analysis and design of simple MOS analog and digital circuits In addition to the above those who have taken EE 130 will find the concepts in this course much easier to understand since greater knowledge of semiconductor physics helps to elucidate the reasons for certain aspects of device design Texts Required R C Jaeger Introduction to Microelectronic Fabrication Vol V of the Modular Series on Solid State Devices 2nd Ed Upper Saddle River New Jersey Prentice Hall 2002 Various material to be distributed throughout the course References some of these on reserve in the Engineering Library S Wolf and R N Tauber Silicon Processing for the VLSI Era Volume 1 Process Technology 2nd Ed Sunset Beach California Lattice Press 1999 S Wolf Silicon Processing for the VLSI Era Volume 2 Process Integration Sunset Beach California Lattice Press 1990 Plummer Deal and Griffin Silicon VLSI Technology Fundamentals Practice and Modeling 2nd Ed Prentice Hall 2000 W Maly Atlas of IC Technologies An Introduction to VLSI Processes Redwood City California Benjamin Cummings Pub Co 1987 EE 143 MICROFABRICATION TECHNOLOGY SPRING 2010 M J Madou Fundamentals of Microfabrication The Science of Miniaturization 2nd Ed CRC Press 2002 B Streetman and S Banerjee Solid State Electronic Devices 6th Ed Prentice Hall 2005 Reading Assignments Reading assignments include sections of the required textbook distributed readings and supplementary notes handed out in lecture Reading assignments are indicated in the COURSE SYLLABUS and will also be included in problem assignments where appropriate Supplementary notes will be handed out for topics where lecture coverage is substantially different from the textbook Students are responsible for all material in the reading In particular the scope of coverage for problem sets the midterm the labs and the final examination includes the reading assignments as well as lecture material Problem Sets There will be a number of problem sets over the course of the semester assigned approximately once per week Each new problem set will normally be posted on the course website the day the previous problem set is due which will be on a lecture day When due problem sets should be turned in at the end of the lecture that day Solutions will be posted on the web Laboratory The laboratory is intended to reinforce the material covered in lecture and in problem sets by providing hands on experience fabricating transistor and micromechanical devices using actual microfabrication processing equipment in a scaled cleanroom facility housed in 218 Cory The fabrication tools available for processing include furnaces for oxidation annealing and sintering a photoresist spinner a contact printing based lithographic exposure tool etch and rinse sinks a metal evaporator and various instrumentation to measure and
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