EE143 Microfabrication Technology Professor Ali Javey ajavey eecs berkeley edu 506 Cory Hall 510 643 7263 TAs SangHoon Lee leesh me berkeley edu Peter Matheu peter matheu berkeley edu John Wyrwas jwyrwas eecs berkeley edu Web Page http www inst eecs berkeley edu ee143 EE143 Ali Javey Slide 0 1 Schedule Lectures Tue Thu 3 30pm 5pm Labs 218 Cory only 5 of the following 6 sections will be offered M 2 5P 218 CORY Tu 10 1P 218 CORY W 9 12P 218 CORY Th 11 2P 218 CORY F 9 12P 218 CORY LAB SECTIONS WILL BEGIN ON January 28th Office Hours Ali Javey Cory Hall 506 Wednesdays 10 11 am TAs TBD EE143 Ali Javey Slide 0 2 Reading Material Primary Text Introduction To Microelectronic Fabrication R C Jaeger Prentice Hall Reference Texts Semiconductor Device Fundamentals R F Pierret Addison Wesley Device Electronics for Integrated Circuits R S Muller and T I Kamins Wiley EE143 Ali Javey Slide 0 3 Grading Laboratory Includes quizzes lab work and reports 30 Homeworks Assigned on Thursdays due the following week in class You must work on your own 10 Tests 2 3 75 minutes each given periodically per schedule Open book and notes No makeups 30 Final Examination Friday Dec 15th 12 30pm3 30pm Open book and notes No makeups Letter grades will be assigned based approximately on the following scale A 95 100 A 88 95 A 85 88 B 80 85 B 73 80 B 68 73 C 65 68 C 60 65 C 55 60 D 40 55 F 40 30 EE143 Ali Javey Slide 0 4 Course Information Prerequisites EE40 E100 and Physics 7B or equivalent Course Description EE143 teaches the fundamentals of integrated circuit IC fabrication and surface micromachining technology giving the student a basic understanding of IC and micromachining processes and the effect of processing choices on device performance Students learn to use process simulation tools and also fabricate and characterize devices in the laboratory This lecture part will cover the processing techniques and design methodologies of microfabrication We will discuss the process modules lithography thermal oxidation diffusion ion implantation etching thin film deposition epitaxy metallization The second part of the course will cover process simulation layout design rules MOS IC and MEMS process integration The laboratory part of the course will provide students opportunities to have hands on experience to fabricate and characterize a NMOS chip with simple MEMS components EE143 Ali Javey Slide 0 5 Course Schedule Introduction to Materials and Processing 1 2 weeks Photolithography 1 week Etching 1 week Oxidation 1 week Deposition 1 week Diffusion 1 week Ion Implantation 1 week Metallization CMP 1 week Simulation Layout 1 week Process Integration 1 week Introduction to Devices 2 weeks Nanolithography and Nanofabrication 1 week EE143 Ali Javey Slide 0 6 Laboratory Information We do our best to limit lab size to 12 people as a result your telebears enrollment is not a guarantee of being assigned to a lab You MUST send an email to Professor Javey ajavey eecs berkeley edu by Thursday 8pm including the following information 1 Full Name 2 Major 3 Year Jr Sr Grad student etc 4 Rank list of preferred lab sections in descending order of preference i e 1st choice 2nd choice 5 List of any lab sections that you CANNOT attend Failure to send an email may result in you being dropped from the course even if you are registered on telebears Final lab assignment will be sent to you via email PLEASE ENSURE THAT YOUR EMAIL ADDRESS ON TELEBEARS IS CORRECT SINCE THIS WILL BE USED FOR OFFICIAL CORRESPONDENCE EE143 Ali Javey Slide 0 7 Lab Safety Week of 1 28 Mandatory Lab attendance required You will have a lab orientation session and will have to pass a safety quiz before you are officially enrolled in this course You MUST attend the lab session to which you are assigned EE143 Ali Javey Slide 0 8 Course Structure Lab and Lecture You learn the theories in class you practice them in lab You are going to make resistors diodes MOS cap bipolar transistor MOS transistor some MEMS structures like bimorphs By the end of the semester you should have learnt basic lab techniques how to operate some fabrication equipment how to characterize the devices you made EE143 Ali Javey Slide 0 9 The EE143 Chip EE143 Ali Javey Slide 0 10 Lab Cleanliness only enter the clean room fully gowned hair net lab coat glove shoe net safety goggles do NOT touch chemicals equipment with bare hands always handle wafers with tweezers and trays unless told otherwise wash hands before and after entering the lab why before so as not to contaminate wafers or equipment after avoid chemicals being indigested 3rd week GSIs will demonstrate how to clean masks 4th week GSIs will demonstrate how to piranhaclean wafers EE143 Ali Javey Slide 0 11 Lab Safety do NOT enter the lab when GSI aren t present know all the emergency exits ask the GSIs to show you know where to find the MSDS under the whiteboard in characterization room know where to find the closet water sources shower eye wash ask whenever not clear do NOT try things out without permission NO eating drinking playing etc inside the lab Things in the lab can be dangerous if not carefully handled Be sure to respect the chemicals EE143 Ali Javey Slide 0 12 Chemical Handling wear protective gear when handling corrosive chemicals face shield chemical apron chemical gloves respirator if necessary check glove for holes check pH of unknown spillage label everything corrosive chemicals H2SO4 HF aluminum etch TMAH wash and rinse the exposed body parts with water for 15mins add acids to water not the other way around handle wet chemicals only at sinks acid on right others on left side EE143 Ali Javey Slide 0 13 Chemical Handling cont d HF be very very careful HF will penetrate your body and attack your skeletal system once you feel it it is already eating your bones apply calcium gluconate if exposure is suspected use only plastic beakers for HF why H2SO4 very painful severely burns add H2O2 to H2SO4 to prepare piranha do not carry the beaker around after mixing HOT use only glass beakers for piranha why Chemicals used in the lab are often harmful Don t breathe and avoid exposure if possible Use teflon ware when handling wafers in acids Be careful those teflon tweezers do not hold the wafers very well EE143 Ali Javey Slide 0 14 Chemical Disposal organic chemicals are discarded in designated containers NOTE in this lab photoresist PR is also dumped down the drain do NOT mix organic wastes with acids why can cause fire or even explosion do NOT
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