CS/COE0447 Computer Organization & Assembly LanguageCourse InformationComputer SystemsDesktop ComputersServersEmbedded ComputersA Cell Phone SystemComputer OrganizationIn CS/COE 447Computer Architecture?Layered Approach in Computer DesignMachine Code ExampleComponents of ISAInside a PCSlide 15Integrated CircuitsTechnology Trend (Processor Complexity)Moore’s LawMemory Capacity Trend (DRAM)Technology Advances (!)Main memoryMain memory, cont’dStorageStorage, cont’dSlide 25Computer Networks(Simple) IC Process OverviewSlide 281CS/COE0447Computer Organization & Assembly LanguageCourse IntroandCHAPTER 12Course Information•Welcome to CS/COE0447!•Professor–Dr. Jan Wiebe•Teaching Assistant–Graduate: Kiyeon Lee–Undergraduate: •Toby Horn, Mike Maksymowych, Jesse Szwedko•Course web page, including syllabus, lectures notes, assignments, labs, schedule, …–http://www.cs.pitt.edu/~wiebe/courses/CS447/Fall073Computer Systems•“Desktop computers”–E.g. PCs, MACs, …–Includes Notebooks•“Servers”–Web servers–File and compute servers–Supercomputers•“Embedded computers”–Usually NOT directly observable–Very wide range of applications4Desktop Computers5Servers6Embedded Computers7A Cell Phone System8Computer OrganizationWe study this part in this course!Study this part in CS1541!9In CS/COE 447•We will study–Computer architecture•MIPS architecture–Concepts of assembler, linker, compiler–Computer arithmetic•Signed and unsigned binary numbers•Floating point format•Operations (add/div/…)–Logic design–Basic processor performance analysis–Processor organization•Datapath•Control•We will do–Assembly language programming (in MIPS)10Computer Architecture?•Computer systems–Underlying hardware–Software running on it•Computer architecture–The hardware/software interface seen by the user –Instruction set architecture (ISA) •Processor microarchitecture–Implementation of a given architecture–May or may not be visible to the user11TransistorsLayered Approach in Computer DesignComputer Architecture orInstruction Set ArchitectureLogic gatesMicroarchitectureArchitecture12Machine Code Exampleswap:muli $t0, $a0, 4add $t0, $a1, $t0lw $t1, 0($t0)lw $t2, 4($t0)sw $t2, 0($t0)sw $t1, 4($t0)jr $ravoid swap(int v[], int k){int temp;temp = v[k];v[k] = v[k+1];v[k+1] = temp;}00000000101000010…00000000000110000…10001100011000100…10001100111100100…10101100111100100…10101100011000100…00000011111000000…compilerassembler13Components of ISA•In most cases, a “programmer’s reference manual” (PRM) will disclose the ISA of a processor•To understand an ISA, find in PRM–Data types the processor supports–Supported instructions and their definitions–Registers (general-purpose & special purpose)–Processor modes–Exception mechanism14Inside a PC•Integrated Circuits (ICs)–CPU (Central Processing Unit), companion chipset, memory, peripheral I/O chip (e.g., USB, IDE, IEEE1394, …)•Printed Circuit (PC) boards (next slide)–Substrate for ICs and interconnection–Distribution of clock, power supply–Heat dissipation•Hard disk, CD-RW DVD-RW, (floppy disk)•Power supply•Chassis–Holds boards, power supply, and provides physical interface for user and other systems•Connectors and cables15Closeup photo of one side of a motherboard PCB, showing conductive traces and solder points for through-hole components on the opposite side.16Integrated Circuits•1mm~25mm on a side•100 ~ 1000M transistors•25 ~ 250M “logic gates”17Technology Trend (Processor Complexity)2x transistors/chip every 1.5 years!18Moore’s Law•The term Moore's Law has been coined by Carver Mead around 1970.[4] Moore's original statement can be found in his publication "Cramming more components onto integrated circuits", Electronics Magazine 19 April 1965:•“The complexity for minimum component costs has increased at a rate of roughly a factor of two per year ... Certainly over the short term this rate can be expected to continue, if not to increase. Over the longer term, the rate of increase is a bit more uncertain, although there is no reason to believe it will not remain nearly constant for at least 10 years. That means by 1975, the number of components per integrated circuit for minimum cost will be 65,000. I believe that such a large circuit can be built on a single wafer.[1]•Astounding that it has held for so long!!!19Memory Capacity Trend (DRAM)1.4x/year or 2x every 2 years8000x since 1980!sizeYearBits10001000010000010000001000000010000000010000000001970 1975 1980 1985 1990 1995 200020Technology Advances (!)•Memory–DRAM capacity: 2x / 2 years (since ’96)–64x size improvement in last decade•Processor–Speed (in terms of clock frequency): 2x / 1.5 years (since ’85)–100x performance improvement in last decade•Disk–Capacity: 2x / 1 year (since ’97)–250x size improvement in last decade21Main memory•PC/servers use “DRAM” (Dynamic RAM)–SDRAM–DDR SDRAM–RDRAM (RAMBUS DRAM)A typical SDRAM “module”22Main memory, cont’d•Embedded computers use DRAM or SRAM (or both) depending on applicationsSRAM, SDRAM, FLASH allin a same chip!23Storage•Secondary storage •Non-volatile•Stores programs, user-saved data, etc.•In PC/server domain, magnetic disk (hard-disk) is usually used•In embedded computers, “flash” memory or “ROM” is usually employed24Storage, cont’d5.25-inch floppy disk1.2MB3.5-inch floppy disk1.44MBUSB Flash card256MB25Storage, cont’d26Computer Networks•Local Area Network (LAN)–Within limited distance (e.g., in a building)–Mostly based on Ethernet–10Mbps, 100Mbps, 1Gbps, 10Gbps, …•Wide Area Network–Connecting networks far apart•Proliferation of wireless LAN (IEEE802.11)–1 ~ 100Mbps27(Simple) IC Process Overview•Silicon ingot (silicon cylinder)•(Blank) Wafers•Various steps to build circuits on wafers–Patterns of chemicals placed wafer•“Wafer test” to sort out bad parts•Tested “die” (diced into components – dies, chips)•“Packaging” steps–Wire bonding (connected to the I/O pins of a package)•“Chip test” to sort out bad parts (mistakes happen during