Page 1Page 2IntroductionChuck ByersBell Labs Fellow - Lucent [email protected] 3Agenda:All PresentersQ&A10:50-11:00LucentChuck ByersApplication Examples & Wrap-up10:40 – 10:50IntelJay GilbertData Transport & Subsidiary Specs10:20 – 10:40Pigeon PointMark OvergaardShelf Management10:00 – 10:20RittalEike WaltzThermal9:45 – 10:00Pentair/SchroffMichael ThompsonMechanical and Power9:15 – 9:45LucentChuck ByersRequirements of Platforms9:05 - 9:15LucentChuck ByersWelcome and Introductions9:00 – 9:05Page 4Goals! Understand the requirements of a modular platform ! Learn the technical details of the AdvancedTCA spec! Study applications of AdvancedTCA! Help you make informed decisions about creating, specifying, or adopting AdvancedTCA technologies.! Help you appreciate the AdvancedTCA Pavilion! Answer your questions.Page 5Overview: What is AdvancedTCA?! Advanced Telecommunication Computing Architecture ! Also known as the PICMG3 family of standards or ATCA! Covers shelves, boards, mezzanines, and management! Valuable as the basis for a standards-based modular platform, on which many applications can be built! Primary application focus:– Telco Carrier Grade applications based on standard fabric solutions! Secondary application focus:– Data Center Modular ServersPage 6Platform Building BlocksAccessApplicationsWirelessApplicationsCore NetworkApplicationsTransportApplicationsServerApplications…Universal PlatformSmall Number of Building BlocksPizza Boxes PICMG3 ShelfCarrierBoardsSBCBoardsI/OBoardsDSP AMCCPU AMCNP AMCOS SoftwareMiddlewarePlatformRequirementsShelves fromSuppliersBoards fromSuppliersMezzanines From SuppliersSoftware fromSuppliersIndustryStandardsTEM MadeElementsPage 7Programmable Processors in AdvancedTCACall Processing• RISC & CISC CPUs• Operate once per “call”• Responsible for feature richness • Heavy SW investment in C codeSignal Processing• DSPs and FPGAs• Operate once per “sample”• Responsible for media stream quality • Standard and proprietary algorithmsRouterVoice GatewayServer FarmIndustrial ControlRNCSoftswitchDSLAMService NodeBase StationMedicalMilitaryFttXEdge SwitchPacket Processing • Network Processors, NSEs, etc.• Operate once per “packet”• Responsible for network performance• Standard and custom protocol stacksOptical TransportPage 8What does the marketplace need from a platform standard?! Scalable shelf capacity to 2.5Tb/s! Scalable system availability to 99.999%! Multi-protocol support for interfaces up to 40Gb/s! Robust power infrastructure and large cooling capacity! High levels of modularity and configurability! Ease of integration of multiple functions and new features! The ability to host large pools of DSPs, NPs ,processors, and storage! Convergence of telecom access, core, optical, and datacenter functions! Advanced software infrastructure providing APIs and OAM&P! High security and regulatory conformance! World-class element cost and operational expense! A healthy, dynamic, multi-vendor, interoperable “eco-system” ! Available now, with a design-in life through at least 2010Page 9AdvancedTCA Standards! Kickoff of informal “Santa Barbara” group 7/20/2001! Officially incorporated as PICMG3 11/13/2001 with 105 companies! Subteams: Form Factor, Backplane/Fabric, RASM! Base Spec (PICMG3.0) covers mechanical, power, cooling, interconnect, and RASM properties of the AdvancedTCA family of specs – 430 pages– ratified 12/30/2002! Subsidiary specs:– 3.1: Ethernet and Fiberchannel Transport– 3.2: InfiniBand Transport– 3.3: StarFabric Transport– 3.4: PCI Express Transport– 3.5: Serial RapidIO! Additional PICMG efforts:– AMC: Advanced Mezzanine Card – CompactTCA– Product Classification Working Group– System Fabric Plane / Internal Time Division Multiplexing (SFP / ITDM)Page 10Michael ThompsonPentair/[email protected]://www.a-tca.comAdvancedTCA®Mechanical PackagingandPower DistributionPage 11ATCA Mechanical Requirements! Targeted for 16 slot shelves in 600 mm ETSI cabinets– 14 slots will fit in an EIA 19” cabinet– 23” telecom cabinets also supported! Large enough board for future requirements! Increased board pitch and room for SMT components on rear side! Cooling for 200W per board! No exotic (expensive) cooling systems! Reliable mechanics– Serviceability, shock and vibration! EMCPage 12Chassis Mechanics, Depth! 600 mm cabinet depth! 25 mm thick doors! 100 mm front cable/air area! 60 mm rear cable/air area! 390 mm remains for chassis! 385 Faceplate to FaceplatePage 13Chassis MechanicsPage 14Chassis Mechanics, Sheet Metal! Sheet Metal construction– Lower cost in high volume– Looser tolerances– Earthquake performance– 1.6 mm to 2.4 mm board PCB thicknessESD clipGuide Rail funnelRetention Screw receptacleAlignment Pin receptaclePage 15Board Mechanics! Front board size 8U x 280 mm! Rear board size 8U x 70 mm– Connects directly to front board! Board width 6HP (1.2”)! PCB thickness: 1.6mm - 2.4 mm allowed! Simplified Telecom Packaging! Provisions for 4 PMCs! Provisions for 8 AMCs! Alignment/Key pinsPage 16Board Mechanics, Face Plate! Sheet metal solution! EMC gasket on left side– Less prone to damage! M3 retaining screw– No tool required! Handle actuated micro switch for Hot Swap! PCB offset 0.1” for all boards! Alignment/Ground pin on Front PanelPage 17Board Mechanics, RTM! 8U x 70 mm form factor! Same mechanics as front board– (Mirror image)! Includes alignment and keying– Key/Alignment to backplane– Key/Alignment to Front Board! Front board to RTM connector undefined! RTM does not connect to backplanePage 18Board Mechanics, Component Height! 21.33 mm maximum component height on side 1! maximum component height on side 2 depends on the board design! ~1.99 mm with flexible side 2 cover and 1.6 mm PCB! ~1.19 mm with flexible side 2 cover and 2.4 mm PCB! ~2.45 mm with 1 mm rigid side 2 cover and 1.6 mm PCB! ~1.65 mm with 1 mm rigid side 2 cover and 2.4 mm PCBPage 19Board Mechanics, ESD Discharge Strips! ESD discharge strips on bottom edge of Front Board and RTM! Segment 1: 10 MOhms to Face Plate– Discharges installer! Segment 2: 10 MOhms to Logic Ground– Discharges board! Segment 3: 0 Ohms to Face Plate– Solid ground even if the board is not mated with the backplane! Keep out area for isolationPage 20! Four stages of alignment– Subrack Guide Rails– Backplane alignment/key pins– Front Panel