ITRS004 Optimization of Package Power Delivery and Power Removal Solutions to meet Platform level Challenges Kaladhar Radhakrishnan Michael J Hill Kemal Ayg n Ayg n Chia Pin Chiu Chia Pin Gaurang Choksi Agenda z z z Metrology for Platform Level Power Delivery Characterization New Power Delivery Architecture and Thermal Considerations for Multi Core Servers Recent Advances in Package Power Delivery and Power Removal Solutions Third party marks and brands are the property of their respective owners 2 Agenda z z z Metrology for Platform Level Power Delivery Characterization New Power Delivery Architecture and Thermal Considerations for Multi Core Servers Recent Advances in Package Power Delivery and Power Removal Solutions Third party marks and brands are the property of their respective owners 3 Enabling Platform Level Power Delivery Characterization y The Power Delivery Network y Time Domain Validation y What is Z f y Measurement Setup y Application Examples y Status Plans Third party marks and brands are the property of their respective owners 4 Typical Power Delivery Network Lvr VID Lskt Rvr Rskt Lvia Lblk LMB Lpkg Rblk RMB Rpkg Cblk CMB Cpkg Rvia Third party marks and brands are the property of their respective owners Rdie Idie Cdie 5 Time Domain Validation Voltage Voltage Transient Transient Test Test VTT VTT Tool Tool Test Test Platform Platform V I Loadline V I y VTT tool is used as CPU emulator y Drawbacks with TD validation VTT tool rise time different from that of processor Not enough insight about the PD solution Third party marks and brands are the property of their respective owners 6 What is Z f VR Components Socket Sink Sink current current from from socket socket i t i t Measure Measure Voltage Voltage at at MB MB sense sense pts pts V f v t V f FFT FFT v t I f i t I f FFT FFT i t v t v t Fourier Transform can be used to determine frequency content of a time domain signal Z f V f I f Third party marks and brands are the property of their respective owners 7 Platform Z f Measurement Setup Host System Scope GPIB Probes USB VTT Tool Target Platform Third party marks and brands are the property of their respective owners 8 Time Frequency Domains 1 i t I f 1 f0 1 2 1 3 FFT 1 5 0 time 1 7 f0 3f0 5f0 7f0 freq f0 3f0 5f0 7f0 freq 3f0 5f0 7f0 freq V f v t FFT time Z f V f I f 0 Z f 0 f0 Third party marks and brands are the property of their respective owners 9 Time Frequency Domains 1 i t I f 1 f1 1 2 1 3 FFT 1 5 0 time 1 7 f1 3f1 5f1 7f1 freq f1 3f1 5f1 7f1 freq 7f1 freq V f v t FFT time Sweep frequency to populate the data points on the impedance profile plot 0 Z f 0 f0 f1 3f0 3f1 5f0 5f17f0 Third party marks and brands are the property of their respective owners 10 Automation Scope Settings VTT Tool Settings Specify Frequency Specify Current Platform Z f can be found in 3 5 minutes Third party marks and brands are the property of their respective owners 11 Typical Platform Z f 4 3 5 Impedance m 3 2 5 Influenced by VR design bandwidth Influenced by bulk caps Influenced by ceramic caps 2 1 5 1 0 5 0 0 0001 0 001 0 01 0 1 1 10 Frequency MHz Third party marks and brands are the property of their respective owners 12 Application LGA775 platform s ap C lk Bu 1 6 1 4 MLCC Caps 10 x 560 uF Bulk Caps 12 x 22 uF MLCC Caps 10 x 820 uF Bulk Caps 12 x 22 uF MLCC Caps 10 x 820 uF Bulk Caps 16 x 22 uF MLCC Caps 2 x 47uF MLCC Caps Impedance m 1 2 Loadline 1m 1 0 8 0 6 0 4 0 2 0 0 0001 0 001 0 01 0 1 1 10 Frequency MHz Third party marks and brands are the property of their respective owners 13 Status Plans for OEM Deployment y Setup and plans demonstrated to OEMs Aug 5 Intel Power Summit at Dupont WA y Customer version of the automation tool is currently being developed Tool will be designed to support different measurement setups using multiple scopes Automation tool will be made available to the OEMs along with the next release of the VTT tool Third party marks and brands are the property of their respective owners 14 Summary y Capability developed for fully automated platform impedance profile measurements y Steps underway for deployment of measurement capability to OEMs Third party marks and brands are the property of their respective owners 15 Agenda z z z Metrology for Platform Level Power Delivery Characterization New Power Delivery Architecture and Thermal Considerations for Multi Core Servers Recent Advances in Package Power Delivery and Power Removal Solutions Third party marks and brands are the property of their respective owners 16 Novel PD Architecture and Thermal Considerations for Multi Core Servers y Itanium Server PD Architecture y Xeon Server PD Architecture y Motivation for new architecture y New PD Scheme for Multi Core Servers y Thermal Considerations Third party marks and brands are the property of their respective owners 17 Itanium Server PD Architecture y Power is supplied through a power pod y Power is delivered through a topside power connector from one side of the package Power Power Connector Connector Lands Lands Power Power Pod Pod Package Package HS HS Mother Mother Board Board Third party marks and brands are the property of their respective owners 18 Xeon Server PD Architecture y y Power is supplied through pins on the socket Power is supplied from the voltage regulator through the pins from two sides on the package Die Die VR VR Components Components Package Package Socket Socket Third party marks and brands are the property of their respective owners VR VR Components Components 19 Motivation for New Architecture y Power Delivery performance is limited with either PD architecture y MB Real Estate for Power Delivery y Opportunity for synergy between the Xeon and Itanium servers Third party marks and brands are the property of their respective owners 20 New Power Delivery Architecture CPU CPU Heatsink Heatsink VR VR Components Components VR VR Board Board Heatsink Heatsink CPU CPU Package Package MB MB Socket Socket CPU CPU Heatsink Heatsink Backing Backing Plate Plate Chassis Chassis Stiffener Stiffener Third party marks and brands are the property of their respective owners 21 New Architecture Package Details y Four sided power delivery scheme for improved performance y Dedicated power connector is more scalable CPU CPU Power Power Connector Connector Lands Lands Third party marks and brands are the property of their respective owners 22 Cross Section TIM3 VR Heatsink TIM2 CPU Heatsink TIM3 TIM1 VR Components Power Connector VR Heatsink VR Components
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