By: Michael Martinez & James ShenENEE 416Device PackagingAgendaAgendaThe following topicsPurposePurposeDie AttachmentDie AttachmentWire BondingWire BondingPackaging TypesPackaging TypesProblems & ChallengesProblems & ChallengesPURPOSEPurposePurposeConnect And ProtectBeyond the Clean RoomDie AttachmentDie AttachmentDie AttachmentEpoxy Die Attachment - Epoxy Cement- Low Temperature- Poor Thermal and Electrical Conductivity-Addition of AluminaEutectic Die Attachment - Gold or Metal Alloy (Au-Ge, Au-Sn)-Eutectic Bond with Si-Die and Package heatedto 390 to 420 C-Simultaneous CrystallizationWire BondingWire BondingWire BondingThermo-compression Ultrasonic ThermosonicWire BondingWire BondingThermocompression-Fine gold wire 15 to 75 um-Ball formation with torch-Compression between substrate and ball -Substrate at 150 C-Interface between 280-350 CAdvantages-Circular tool movement around initial bond -Low CostDisadvantages-Formation of inter-metallic compounds-High temperature bad for epoxyWire BondingWire BondingUltrasonic-Aluminum wire -Ultrasonic vibration between 20 to 60 kHz-Free flowing Al onto bonding area -Pressure applied at room temperatureAdvantages-Low temperature-No oxidation defectsDisadvantages-Front to back tool movement-Platform movement needed to bond wires around a rectangular dieWire BondingWire BondingThermosonic-Aluminum or Gold wire -Ultrasonic vibration between 20 to 60 kHz-Free flowing metal onto bonding area -Pressure applied with substrate at 150 CAdvantages-Low temperature-No oxidation defects-Full tool movement after initial bond-Easy automation Disadvantages-Front to back tool movementPackage TypesPackage TypesPackage TypesStandard IC Packaging Types:• TO-style •4 to 48 pin configuration• DIPS•4 to 80 pin configurationPackage TypesPackage Types•Standard IC Packaging Types:• Leadless Chip Carriers •4 to 124 pin configuration• Surface Mount•High density pin count• Pin-Grid Arrays •High density pin countProblems & ChallengesChallengesChallenges•Electrical Characteristic• Mechanical Stresses• Thermal conductivity• Environmental•
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