Mechanical Fastening Processes BrazingSlide 2Slide 3Brazing Various MethodsSlide 5Mechanical Fastening Processes SolderingSlide 7Adhesive BondingSlide 9Slide 10Adhesive Bonding Surface Prep, Process Capabilities, and ApplicationsSlide 12Adhesive Bonding Design for Adhesive BondingMechanical FastenersSlide 15Slide 16Slide 17Joining Plastics, Ceramics, and GlassesSlide 1932.7 Economics of Joining OpsCloser look at Brazing CostsSlide 22Slide 23Surface TechnologySurface TechnologySlide 26Chapter 33 Surface Roughness and Measurements of Friction, Wear and Lubircation33.2 Surface Structure and IntegritySlide 29Surface IntegritySlide 31Slide 32Slide 33Slide 34Slide 35Slide 36Slide 37Slide 38Slide 39Slide 40Slide 4133.5 WearSlide 43Adhesive WearAbrasive WearOther types of Wear33.6 Lubrication33.6 Lubricants33.7 Metalworking FluidsOils and EmulsionsSynthetic solutions Soaps, greases, waxesAdditivesSolid LubricantsSelection of Metalworking FluidsBiological and Economical ConsiderationsBibliographyMechanical Fastening Mechanical Fastening ProcessesProcessesBrazingBrazingBra zingBra zing – joining process where – joining process where just the filler material’s heat is just the filler material’s heat is raised to its melting temperature raised to its melting temperature to join materialsto join materialsFirst used as far back as 3000 to First used as far back as 3000 to 2000 B.C.2000 B.C.Filler material has a lower Filler material has a lower melting temperature than melting temperature than components that you are joining.components that you are joining.Mechanical Fastening Mechanical Fastening ProcessesProcessesBrazingBrazingBrazing uses a flux in order Brazing uses a flux in order to prevent oxidation during to prevent oxidation during the joining processthe joining processFactors that affect braze Factors that affect braze strengthstrengthJoint clearanceJoint clearanceJoint areaJoint areaThe bond formed between The bond formed between the filler material and the the filler material and the base metalbase metalProper use of fluxProper use of fluxBrazingBrazingVarious MethodsVarious MethodsTorch – uses oxyfuel thru a torchTorch – uses oxyfuel thru a torchFurnace – parts preloaded with Furnace – parts preloaded with consumable inserts then placed in consumable inserts then placed in furnace for uniform heatingfurnace for uniform heatingInduction – Heats thru use of High Induction – Heats thru use of High freq ACfreq ACDipping – dips entire base Dipping – dips entire base material into molten filler metal material into molten filler metal bath (used for very small parts)bath (used for very small parts)Mechanical Fastening Mechanical Fastening ProcessesProcessesSolderingSolderingMain difference between soldering and Main difference between soldering and Brazing lies in Temperature.Brazing lies in Temperature.Uses primarily tin-lead as filler materialUses primarily tin-lead as filler materialMain use is for electronics which can’t Main use is for electronics which can’t withstand extreme heat of brazing.withstand extreme heat of brazing.Uses same techniques as brazing as Uses same techniques as brazing as well as that of Wave soldering – very well as that of Wave soldering – very useful for circuit boards.useful for circuit boards.Adhesive BondingAdhesive BondingTypes of AdhesivesTypes of AdhesivesNatural adhesives-starch, dextrin, soya Natural adhesives-starch, dextrin, soya flour, and animal productsflour, and animal productsInorganic Adhesives-sodium silicate and Inorganic Adhesives-sodium silicate and magnesium oxychloridemagnesium oxychlorideSynthetic organic adhesives-Synthetic organic adhesives-thermoplastics, thermosetting polymers thermoplastics, thermosetting polymers (most important in manufacturing)(most important in manufacturing)Adhesive BondingAdhesive BondingElectronically Conducing Electronically Conducing AdhesivesAdhesivesDeveloped to replace lead-Developed to replace lead-based solder, added metal based solder, added metal particles (40% to 70%)particles (40% to 70%)Used in electronics such as Used in electronics such as calculators, TVs, and LCDscalculators, TVs, and LCDsAdhesive BondingAdhesive BondingTABLE 30.4Type Comments ApplicationsAcrylic Thermoplastic; quick setting; tough bond at roomtemperature; two component; good solvent chemicaland impact resistance; short work life; odorous;ventilation requiredFiberglass and steel sandwich bonds,tennis racquets, metal parts,plastics.Anaearobic Thermoset; easy to use; slow curing; bonds at roomtemperature; curing occurs in absence of air, will notcure where air contacts adherents; one component; notgood on permeable surfacesClose fitting machine parts such asshafts and pulleys, nuts and bolts,bushings and pins.Epoxy Thermoset; one or two component; tough bond;strongest of engineering adhesives; high tensile and lowpeel strengths; resists moisture and high temperature;difficult to useMetal, ceramic and rigid plastic parts.Cyanoacrylate Thermoplastic; quick setting; tough bond at roomtemperature; easy to use; colorless.“Crazy glue.” ™Hot melt Thermoplastic; quick setting; rigid or flexible bonds;easy to apply; brittle at low temperatures; based onethylene vinyl acetate, polyolefins, polyamides andpolyestersBonds most materials. Packaging,book binding, metal can joints.Pressure sensitive Thermoplastic; variable strength bonds. Primer anchorsadhesive to roll tape backing material, a release agenton the back of web permits unwinding. Made ofpolyacrylate esters and various natural and syntheticrubberTapes, labels, stickers.Adhesive BondingAdhesive BondingSurface Prep, Process Capabilities, and Surface Prep, Process Capabilities, and ApplicationsApplicationsSurface PreparationSurface PreparationSurface must be free of dirt, dust, Surface must be free of dirt, dust, oil and any other contaminantsoil and any other contaminantsPorous or rough surface is Porous or rough surface is desirable, improve adhesiondesirable, improve adhesionProcess CapabilitiesProcess CapabilitiesUsed to bond metallic and non-Used to bond metallic and non-metallic materialmetallic materialDo not subject to peelingDo not subject to peelingAdhesive BondingAdhesive BondingSurface Prep, Process Capabilities, and Surface Prep, Process Capabilities, and ApplicationsApplicationsApplicationsApplicationsUsed in most industriesUsed in