Andy CheungProduct Design CycleDatasheet Specification ExampleAbsolute Maximum RatingsOperating RatingsSlide 6Testing IC’sCorrelationTest Matrix-LDOHandlerSlide 11Test FloorCorrelationTypical Equipment SetupBench SetupCorrelation -Test BoardDropout Voltage & Ground Current MeasurementSlide 18Correlation WorksheetCharacterizationSlide 21Datasheet ReviewSIT LimitsWafer SortWafer Probe StationFinal TestHAPPY THANKSGIVING!!!Andy CheungNew Product Development EngineerMicrel Inc.November 26, 2003Product Design CycleDesignTestApplications/MarketingProductDatasheet Specification ExampleAbsolute Maximum RatingsOperating RatingsTesting IC’s1. Correlation2. Characterization3. Wafer Sort4. Final TestCorrelationTest Matrix by designAll tests listedTypically follows datasheetTests implemented on automatic testerResponsibility of test engineerTMT, Eagle Test SystemsTest Matrix-LDOTest Condition Applied SignalMeasured SignalVin (Pin 1)Vout (Pin 2)Gnd (Pin 3)Ven (Pin 4)Ignd, on Ven = 3V Venable, Vin Ignd 5V open Meas 3VIgnd, off Ven = 0V Venable, Vin Ignd 5V open Meas 0VVdo Iout = 100mAVin=Vout +1V, Iout Vin-VoutVout+1 & sweep Meas 0V 3VVdo Iout = 500mAVin=Vout +1V, Iout Vin-VoutVout+1 & sweep Meas 0V 3VHandlerHandlerTest FloorCorrelationBenchConfirm all TMT dataLearn DeviceFind problemsAccurate measurementsEquipment MethodTypical Equipment SetupOscilloscope with ProbesPair of DC Power Supplies0-25V0-4APair of Digital Multi MetersTest BoardSolder StationParametric AnalyzerSource MeterCurrent ProbeFreeze Spray and Heat gunBench SetupCorrelation-Test BoardDropout Voltage & Ground Current MeasurementDC ErrorsGround wire length100mOhm*500mA = 50 μVIntroduces losses in current measurementsNeed voltage accuracy to 1 or 2 μV4 wire senseKelvin contactsDropout Voltage & Ground Current MeasurementLDO+-VVinSense Node(Kelvin Contact)Normal WireIAmmeterGroundCorrelation WorksheetTEST CONDITION TESTER DATA BENCH DATA UNIT % CHANGEIgnd, on Ven = 3V 1.5 1.45 mA 3.45%Ignd, off Ven = 0V 1 0.95 uA 5.26%Vdo Iout = 100uA 250 240 mV 4.17%Vdo Iout = 500mA 500 475 mV 5.26%CharacterizationCharacterization is Done to: Find the Device’s Capabilities and LimitationsPerformance over TemperatureFind RandomnessResults:Single Insertion Test LimitsSpecification ChangeDetermine ProblemsCharacterizationParts typically follow a normal (gaussian) distribution. Test parts at all possible operating conditions per specification parameters.Typically done on handlers to simulate production environment.Most stringent testing.Datasheet ReviewDevice Realized?Changes?Deletions?Yield Improvements?Problems?SIT LimitsUse characterization data to ensure device operation over temperature.GuardbandsTemperatureTesterWafer SortTightest LimitsWafer TrimBandgapFrequencyWafer Probe Station for Bench TestingGate Stress PadsEnsure Test is CorrectWafer Probe StationFinal TestGuarantee parts operated as written on datasheet.Uses SIT limits generated from characterization.HAPPY THANKSGIVING!!!HAPPY THANKSGIVING!!!Major Test CheckpointsMajor Test CheckpointsCorrelationCorrelationCharacterizationCharacterizationWafer Sort Wafer Sort Final TestFinal