ECE 3110: Introduction to Digital SystemsPrevious class SummaryDigital LogicSlide 4Electronic aspect of digital designSoftware aspect of digital designIntegrated Circuits (IC)DIPProgrammable Logic Device (PLD)CPLD vs FPGAApplication-Specific ICs (ASIC)Printed-Circuit BoardSummaryNext…ECE 3110: Introduction to Digital SystemsIntroduction (Contd.)2Previous class SummaryDigital devicesDigital vs. analogWhy digital3Digital LogicBinary system -- 0 & 1, LOW & HIGH, negated and asserted.Basic building blocks -- AND, OR, NOT45Electronic aspect of digital designDigital abstractionRangeNoise marginInvalid rangeSpecifications6Software aspect of digital designDigital design need not involve any software tools. But: modern design, software tools are essential.Examples:Schematic entry, HDLs (platform compilers, simulators, synthesis tools), simulators, test benches, timing analyzers and verifiers, word processors, high-level languages, CAD7Integrated Circuits (IC)A collection of one or more gates fabricated on a single silicon chip.Wafer, dieSmall-scale integration (SSI): 1-20DIP: dual in-line-pin packagePin diagram, pinoutMSI: 20-200 gatesLSI: 200-200,000VLSI: >100,000, 50million (1999)8DIPpinout9Programmable Logic Device (PLD)ICs which Logic function can be programmed after manufacturing.2-level AND-OR gates using user-programmable connectionsPLAs: programmable Logic Arrarys.PALs: programmable array logic devicesProgrammable logic devices (PLDs)CPLD: complex PLDFPGA: Field-Programmable Gate Array10CPLD vs FPGA11Application-Specific ICs (ASIC)Semi-custom IC: chips designed for a particular, limited product/applicationReducing chip count, size, power consumptionHigher performance.NRE: nonrecurring engineering costStandard cells: libraryGate array: an IC with internal structure as an array of gates, unspecified interconnection12Printed-Circuit BoardPCB or PWB (printed-wiring board)Mount ICs so that an IC can connect to other ICs in a system.SMT: Surface-mount technologyMCM: multi-chip modules: high speed and density.13SummaryElectronics aspects of digital designIntegrated Circuits (wafer, die, SSI, MSI, LSI, VLSI)PLDs: PLAs, PALs, CPLD, FPGAASIC14Next…Number systemsReading: Wakerly chapter