Data sheet acquired from Harris SemiconductorSCHS018C – Revised September 2003The CD4007UB types are supplied in 14-leadhermetic dual-in-line ceramic packages(F3A suffix), 14-lead dual-in-line plasticpackages (E suffix), 14-lead small-outlinepackages (M, MT, M96, and NSR suffixes),and 14-lead thin shrink small-outlinepackages (PW and PWR suffixes).Copyright  2003, Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageTypePackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD4007UBE ACTIVE PDIP N 14 25 Pb-Free(RoHS)CU NIPDAU N / A for Pkg TypeCD4007UBF ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg TypeCD4007UBF3A ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg TypeCD4007UBF3A116 OBSOLETE CDIP J 14 TBD Call TI Call TICD4007UBM ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBM96 ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBM96E4 ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBME4 ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBMT ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBMTE4 ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBNSR ACTIVE SO NS 14 2000 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBPW ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD4007UBPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please checkhttp://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.PACKAGE OPTION ADDENDUMwww.ti.com12-Jan-2006Addendum-Page 1Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.PACKAGE OPTION ADDENDUMwww.ti.com12-Jan-2006Addendum-Page 2MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE14 PINS SHOWN0,65M0,100,100,250,500,750,15 NOMGage Plane289,809,60247,907,7020166,606,404040064/F 01/970,306,606,2080,194,304,5070,1514A11,20 MAX145,104,9083,102,90A MAXA MINDIMPINS **0,054,905,10Seating Plane0°–8°NOTES: A. All linear dimensions are in millimeters.B. This drawing is subject to change without notice.C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.D. 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