CHE312: Problem set #51-8 Copy the program heat5.exe from the class distribution folder to your flash or H drive.You can also download the program from the website: https://www.csupomona.edu/~tknguyen/che312/homework.htm. Run the program and choose problem 1-8 in any order. Solve the problems with the dataprovided by the program, copy the problem statement to Word. The program will check youranswer and provide an answer code when you click on “Check”. Copy the answer code andpaste them after the problem statement. Your need to present all your work in details to getfull credit. Your work should look like this:1) An annealing process shown below uses a hot plate operating at an elevated temperatureTh. The wafer, initially at a temperature of Tw,i, is suddenly positioned at a gap separation h =0.5 mm from the hot plate. The emissivity of both the hot plate and the wafer is 1.0. Thesilicon wafer has a thickness of d = 0.80 mm, a density of 2700 kg/m3, and a specific heat of1050 J/kgK. The thermal conductivity of the gas in the gap is 0.0436 W/mK. The wafer isinsulated at the bottom. Stefan-Boltzmann constant  = 5.6710-8 W/m2K4. For Th = 700oCand Tw,i = 25oC, calculate the radiative heat flux across the gapProblem 1: Correct, Code =4313336481Solutiongap hHot plate, ThSilicon wafer, TwStagnant gas, k The radiative heat flux across the gap5.6710-8[(700 + 273)4  (25 + 273)4] = 50,370 W/m2Box the answer(s)!9.1Copper tubing is joined to a solar collector plate of thickness t, and the working fluidmaintains the temperature of the plate above the tubes at To. There is a uniform netradiation heat flux q”rad to the top surface of the plate, while the bottom surface is wellinsulated. The top surface is also exposed to a fluid at T that provides for a uniformconvection coefficient h.(a) Derive the differential equation that governs the temperature distribution T(x) in theplate.(b) Obtain a solution to the differential equation for appropriate boundary