EE C245 / ME C218 INTRODUCTION TO MEMS DESIGN FALL 2007 INFORMATION ABOUT THE MIDTERM EXAM Extra Office Hours: Prof. Nguyen will hold extra office hours from 3-4:30 p.m. on Monday, Oct. 29, and will extend office hours on Thursday, Oct. 25, from 3-5:30 p.m. Date of Exam: Tuesday, Oct. 30, 9:30-11 a.m. (sharp) Place: 3108 Etcheverry (our regular room) General Information: The exam will be open book and open notes. Bring a calculator to the exam. You will be provided with exam sheets with enough space to put all your work on these sheets. You should show and include all your work on the exam sheets. The exam will consist of a few problems, each with a number of parts. Material to be Covered: Reading in Senturia, class lecture notes, handouts, and homeworks. The exam is meant to in-clude all material covered so far in the class. You might pay particular attention to the following areas: 1. Basic MEMS fabrication process modules, including oxidation, film deposition, lithog-raphy, etching, ion implantation, diffusion, and bonding. You should especially have a good understanding of MEMS-centric etching and what influences selectivity and the de-gree of anisotropy. 2. Physics of stiction and bending/warping due to residual or thermal stresses and other phe-nomena. Be able to quantitatively determine whether a particular structure is warped or stuck down, or the degree to which its frequency has shifted from a designed value due to stress or other phenomena. 3. MEMS process flow design and layout. Be prepared to design your own process flow and layout for some arbitrary cross-section or 3D structure. 4. Surface micromachining, including its basic process flow, release issues (e.g., stiction), material choices, residual stress, stringers and methods for eliminating them. 5. Bulk micromachining, including selective wet etch methods, deep reactive ion etching, and bonding methods. 6. Mechanics of materials for MEMS, including stress, strain, material properties, and on-chip measurement & characterization of mechanical properties. 7. Microstructural elements, including bending moment and strain, flexural rigidity, residual stress analysis, boundary conditions, and spring combinations.EE C245 / ME C218 INTRODUCTION TO MEMS DESIGN FALL 2007 8. Energy methods for determination of deflection functions and resonance
View Full Document
Unlocking...