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MIT 2 830J - Control of Manufacturing Processes

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BackgroundExpectationsSyllabus DetailsSyllabus DetailsTeam ProjectsMain TopicsManufacturing Process ControlFocusTypical Process Control ProblemsTypical Process Control ProblemsOther Related Problems – Cost, Rate and Flexibility:Manufacturing ProcessesThe Process ComponentsProcess DefinitionConceptual Semiconductor Process ModelSimplified Conceptual Semiconductor Process ModelExample: OxidationExample: OxidationOxidation Models(Semiconductor) Manufacturing Process ControlProcess Model for ControlThe General Process Control ProblemProcess Control HierarchyBack to the Process: What Causes the Output Change?Modes of Geometry Change?What Causes Variation in the Process Output?Process Model for ControlWhat are the Process Parameters?Energy StatesPropertiesA Model for Process VariationsPrimary Process Control Goal: Minimize DYORORProcess Control HierarchyMIT OpenCourseWare ____________http://ocw.mit.edu 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303)Spring 2008For information about citing these materials or our Terms of Use, visit: ________________http://ocw.mit.edu/terms.1ManufacturingControl of Manufacturing ProcessesSubject 2.830/6.780/ESD.63Spring 2008Lecture #1IntroductionFebruary 5, 20082ManufacturingBackground• Pre-requisites• Your Background and Interests• Relevant Experience• Course Schedule3ManufacturingExpectations• Assignments ~ Weekly• 2 Quizzes in Class• Group Project – End of term presentation– Report4ManufacturingSyllabus Details• Lecturers– Duane Boning– David Hardt• Course Secretary: Sharlene Blake5ManufacturingSyllabus Details• Prerequisites: One of the following :– 2.008 or 2.810 Manufacturing– 2.751J or 6.152J or 6.041 or 15.064J• Required Texts:– Montgomery, D.C., Introduction to Statistical Quality Control, 5thEd. Wiley, 2005– May and Spanos, Fundamentals of Semiconductor Manufacturing and Process Control, John Wiley, 2006.• Grading:– Problem sets 40%– Quizzes 40%– Team Projects 20%• Assignments: All except project are to be individual efforts• Final exam: No final exam• Course URL: (Registration and Certificate Required)6ManufacturingTeam Projects• Topics:– Process Diagnosis– Process Improvement– Process Optimization / Robustness– Advanced Applications• Expectations– Background research on process and problem– Use of existing data or generation of new data– Oral presentation of results– Project report from group7ManufacturingMain Topics• Physical Origins of Variation– Process Sensitivities• Statistical Models and Interpretation– Process as a Random Variable(s)– Diagnosis of Problems• Effects Models and Designed Experiments– Input - Output Empirical Models• Process Optimization (Robustness)– Ideal Operating Points8ManufacturingManufacturing Process Control• Process Goals–Cost– Quality–Rate– Flexibility9ManufacturingFocus• Unit Operations• (1) Maximizing Quality– Conformance to Specifications• (2) Improving Throughput• (3) Improving Flexibility• (4) Reducing Cost10ManufacturingTypical Process Control Problems• Minimum feature size on a semiconductor chip has too much variability• DNA diagnostic chip has uneven flow channels• Toys never fit when assembled at home!• Next generation high density electrical connector cannot be made reliably11ManufacturingTypical Process Control Problems• Airframe skin needs trimming and bending to fit frame• Web thickness of a machined panel is non-uniform• Plastic throttle bodies for fuel injection are out of round• Submarine hull welds need constant rework in production12ManufacturingOther Related Problems –Cost, Rate and Flexibility:• 100% inspection with high scrap rates– low throughput– high costs• 100% inspection with frequent rework – low throughput– high costs• High variability at changeover– Reluctance to changeover – low flexibility13ManufacturingManufacturing Processes• How are they defined?• How do they do their thing?• How can they be categorized?• Why don’t they always get it right?14ManufacturingThe Process ComponentsEquipmentWorkpiece MaterialOperator Part•Etch bath• Injection Molder • Lathe• Draw Press•...• Coated Silicon • Plastic Pellets• Bar stock• Sheet Metal•...•IC chip• Connector Body• Shaft•Hood•...15ManufacturingProcess DefinitionA Manufacturing Process is a Change in the Workpiece Material• A change in geometry• A change in constitutive properties16ManufacturingConceptual Semiconductor Process ModelBoning et al., c. 1990Image removed due to copyright restrictions. Please see Fig. 1 in Boning, D. S., et al. “A General Semiconductor Process Modeling Framework.” IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.17ManufacturingSimplified Conceptual Semiconductor Process ModelImage removed due to copyright restrictions. Please see Fig. 15 in Boning, D. S., et al. “A General Semiconductor Process Modeling Framework.” IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.18ManufacturingWafer statesExample: OxidationImage removed due to copyright restrictions. Please see Fig. 17 in Boning, D. S., et al. “A General Semiconductor Process Modeling Framework.” IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.19ManufacturingExample: OxidationTreatment (wafer environment)Image removed due to copyright restrictions. Please see Fig. 18 in Boning, D. S., et al. “A General Semiconductor Process Modeling Framework.” IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.20ManufacturingOxidation ModelsEmpirical: Change in wafer stateAnalytic: Deal-GroveEmpirical: Equipment model for mean and std. dev. of oxide thicknessImages removed due to copyright restrictions. Please see Fig. 19 and 20 in Boning, D. S., et al. “A General Semiconductor Process Modeling Framework.” IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.21Manufacturing(Semiconductor) Manufacturing Process ControlImage removed due to copyright restrictions. Please see Fig. 26 in Boning, D. S., et al. “A General Semiconductor Process Modeling Framework.” IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280.22ManufacturingProcess Model for ControlEquipment MaterialE(t)“controls”Geometry &PropertiesY =Φ(α)α≡ process parametersWhat are the α’s?ProcessY≡Process


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