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DEEP WET AND DRY ETCHING OF PYREX GLASS



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DEEP WET AND DRY ETCHING OF PYREX GLASS A REVIEW CIPRIAN ILIESCU1 KWONG LUCK TAN1 FRANCIS E H TAY1 2 and JIANMIN MIAO 3 1 Institute of Bioengineering and Nanotechnology Singapore 2 Department of Mechanical Engineering National University of Singapore Singapore 3 Micromachines Center School of MPE Nanyang Technological University Singapore E mail ciliescu ibn a star edu sg ABSTRACT This paper is a review of wet and dry etching of one of the most common types of glass Pyrex The paper analyzes the methods for increasing the glass etch rate in HF solutions namely annealing concentration ultrasonic agitation and temperature The limitations of the wet etching of glass are also presented Mashing layers commonly used for deep wet etching of glass are analyzed in terms of the process time required until the defects are generated in the masking layer The improvement of the surface roughness for deep wet etching of Pyrex glass is another subject that will be explored The highest etch depth 500 m of annealed Pyrex glass is achieved by wet etching in highly concentrated HF solution using Cr Au with the assistance of photoresist as a masking layer The paper also reports a new technique of dry etching of Pyrex glass in C4F8 using bulk silicon mask Keywords glass etching masking layer 1 INTRODUCTION Glass is a widely used material in MEMS and biochip device fabrication The classical piezoresistive pressure sensor chip is bonded on a glass substrate A microgyroscope that is vacuum sealed between two structured glasses at the wafer level is presented in 1 A micro XY stage actuator made with glass has been reported in 2 Most biochips are fabricated on a glass substrate due to its optical transparency and biocompatibility A microflow of cells for the single molecule handling of DNA is presented in 3 A microPCR for DNA amplification is shown in 4 while dielectrophoresis is represented in 5 Three major groups of techniques are used in glass etching mechanical dry and wet Mechanical



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