1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265Copyright  2003 Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.Data sheet acquired from Harris SemiconductorSCHS115D – Revised September 2003VOHThe CD4093B types are supplied in 14-leadhermetic dual-in-line ceramic packages (F3Asuffix), 14-lead dual-in-line plastic packages (Esuffix), 14-lead small-outline packages (M, MT,M96, and NSR suffixes), and 14-lead thin shrinksmall-outline packages (PW and PWR suffixes).PACKAGE THERMAL IMPEDANCE, θJA (See Note 1):E package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NOTE 1: Package thermal impedance is calculated in accordance with JESD 51-7.VDDVDDVPVNVSSVOL2POST OFFICE BOX 655303 • DALLAS, TEXAS 752653POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PACKAGING INFORMATIONOrderable Device Status(1)PackageTypePackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)7704602CA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NCCD4093BE ACTIVE PDIP N 14 25 Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCCD4093BF ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NCCD4093BF3A ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NCCD4093BM ACTIVE SOIC D 14 50 Pb-Free(RoHS)CU NIPDAU Level-2-260C-1 YEAR/Level-1-235C-UNLIMCD4093BM96 ACTIVE SOIC D 14 2500 Pb-Free(RoHS)CU NIPDAU Level-2-260C-1 YEAR/Level-1-235C-UNLIMCD4093BMT ACTIVE SOIC D 14 250 Pb-Free(RoHS)CU NIPDAU Level-2-260C-1 YEAR/Level-1-235C-UNLIMCD4093BNSR ACTIVE SO NS 14 2000 Pb-Free(RoHS)CU NIPDAU Level-2-260C-1 YEAR/Level-1-235C-UNLIMCD4093BPW ACTIVE TSSOP PW 14 90 Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIMCD4093BPWR ACTIVE TSSOP PW 14 2000 Pb-Free(RoHS)CU NIPDAU Level-1-250C-UNLIM(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please checkhttp://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.PACKAGE OPTION ADDENDUMwww.ti.com12-Apr-2005Addendum-Page 1MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999POST OFFICE BOX 655303 • DALLAS, TEXAS 75265PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE14 PINS SHOWN0,65M0,100,100,250,500,750,15 NOMGage Plane289,809,60247,907,7020166,606,404040064/F 01/970,306,606,2080,194,304,5070,1514A11,20 MAX145,104,9083,102,90A MAXA MINDIMPINS **0,054,905,10Seating Plane0°–8°NOTES: A. All linear dimensions are in millimeters.B. This drawing is subject to change without notice.C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.D. Falls within JEDEC MO-153IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. To minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant