EE 439/539 VLSI Technology and Fabrication (3 Cr. Hrs)PREREQUISITE: EE 331COURSE GOALS AND OBJECTIVESTEXT BOOKSECONDARY TEXTS/REFERENCESDEPARTMENT OF ELECTRICAL ENGINEERINGUniversity of South AlabamaCourse Syllabus Spring 2004EE 439/539 VLSI Technology and Fabrication (3 Cr. Hrs) PREREQUISITE: EE 331 INSTRUCTOR: Aurangzeb Khan, Ph.D Office: EEB 51 E-mail: [email protected] Phone: 460-6923 Office Hours: COURSE GOALS AND OBJECTIVESThe aim of the course is to provide students with a glimpse into the semiconductor industrythat has brought about the technology revolution. Because of the interdisciplinary nature ofthe subject, its content includes concepts from electrical engineering, chemical engineeringand material science. In lectures we will develop an understanding of the basic process used inmonolithic integration-circuit (IC) fabrication. The entire process of manufacturing a IC canbe broken up into a series of unit operations like Chemical Vapor Deposition, Lithography,Etch, etc., that are unique. This course will address the main chemical engineering processesthat govern each of these unit operations, and integrating these steps into a flow that results ina working IC. At the end of this course one should have a good understanding of the variousprocessing techniques used to fabricate integrated circuits and microstructures. One shouldunderstand the theory of the individual, processes, how they are characterized, bothelectrically and structurally, and the interrelationship of these processes when combined tofabricate integrated circuits or microstructures.INSTRUCTIONAL MATERIAL:TEXT BOOKSilicon VLSI Technology: Fundamental, Practice and modeling , James D. Plummer, Michael D. Deal,Peter B. Griffith, Prentice Hall (2000).OTHER RESOURCESApart from the text, there will be handouts given out periodically.Journals: IEEE Transactions on Electron DevicesIEEE Electron Device LettersJournal of Applied PhysicsApplied Physics LettersJournal of the Electrochemical Society1Journal of Crystal GrowthJournal of Electronic MaterialsSECONDARY TEXTS/REFERENCESThe Science and Engineering of Microelectronic Fabrication, 2nd edition (2001), Stephen A. Campbell, Oxford University Press.Introduction to Microelectronics fabrication, 2nd edition, Riched C. Jaeger, Prentice Hall (2002).VLSI Technology, S. M. Sze, McGraw Hill, New York, 1983.Silicon Processing for the VLSI Era, S. Wolf and R. Tauber Lattice Press, 1986.VLSI Fabrication Principles, S.K. Ghandi Wiley, Second Edition, 1994.Modular Series on Solid State Devices. Pierret / Neudeck Vol. 1-5, Addison- Wesley, 1984.Thin Film Processes. J.L. Vossen and W. Kern , Academic Press, 1978.Electronic Materials Science: For Integrated Circuits in Si and GaAs, J.W. Mayer and S.S. Lau, Macmillan, 1990. Electronic Materials Science and Technology, S.P. Murarka and M.C. Peckerar Academic Press, 1989.The Materials Science of Thin Films, M. Ohring , Academic Press, 1992.TENTATIVE COURSE OUTLINE:1. Overview of Silicon Processing2. Crystal Growth and Doping3. Clean room wafer cleaning4. Photolithography5. Oxidation6. Diffusion7. Ion Implantation8. Thin film Epitaxial Growth and CVD9. Etching10. Backend technology11. SUPREM Simulation12. CMOS Process Integration13. Bonding and PackagingCLASS TIME: Monday, Wednesday: 12:10 pm – 1:25 pm in room EEB 35.CLASS ATTENDACE POLICY Attendance is strongly recommended to achieve the objectives of the course but absences arenot panelized. But attendance at test is mandatory. If there is an emergency, let me know and it will bedecided case-by-case basis. Students are responsible for all material covered in the class also theannouncements for homework assignments due dates, and test dates. Some lectures will treat materialnot covered in the textbook. NUMBER AND TYPE OF EXAMINATIONS TO BE GIVEN DURING THE SEMESTER:2At least four quizzes, one midterm examination and one final examination will be given. Themidterm examination will be given during the semester. The examination dates will be announced inclass, and will cover material discussed in lectures and/or specified part of the textbook. The finalexam will be comprehensive, but weighted heavily on material not covered in the midtermexaminations. Homework, quizzes, and final report, which are required in this course, have the primaryfunction of helping you learn the material. The secondary function of these assignments is to aid theinstructor in assessing your understanding of the material, in particular when the time comes toprovide a final grade for the course.Homework assignments are intended nearly exclusively to serve as a learning tool. Assuch, I am not comfortable with copying amongst students on the solving of theseassignments.In-class quizzes are important to the instructor in assessing your performance.Collaboration in taking these exams is not permitted. In particular, the take home exam orassignment must be exclusively your own work, and you can only discuss it with theinstructor or teaching assistant for this course.MAKE-UP EXAMINATION POLICY:Make-up examinations will be in extending circumstances such as death in the family, illnessor accident. Your instructor will decide after verifying the proper written documentation. Failure tofurnish written, verifiable documentation will result in a grade of zero for the missed examination.COURSE ASSIGNMENTS:Homework/assignments will be assigned periodically. Sometime advance level assignmentswill be given to EE539 students.PENALTY FOR LATE WORK: All assignments must be submitted on the due date. Late assignments will not be accepted.GRADING POLICY: Quizzes, homework/assignments: 30% (there will be one surprise quiz, which will be included in the final grade) Midterm: 30% Final paper: 40%GRADE ASSIGNMENT:90 – 100% A80 – 89% B70 – 79% C60 – 69% DBelow 60% FSTUDENT WITH SPECIAL NEEDS:By the federal disabilities Act. , Students with bona fide disabilities will be afforded reasonable accommodations. The office of special student services will certify a disability and inform the instructor of reasonable accommodations. Also Ms. Bernita