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UMD
ENMA 490 -
Fabricating a Bubble Valve
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Fabricating a Bubble ValveMaterials: Bottom Wafer Fabrication ProcedureFor Steps 1-5, refer to Fabricating an Electrically Actuated Valve: Sputter Deposition of PZT for use in microfluidic devicesStep 6: Mask3. Deposit Platinum (Bottom Electrode)Anneal 500°C-700°CCover Pt with a layer of LPCVD Silicone dioxide and exposeDesired electrode pattern (Papavasilou, Berkeley)1-SiN-Silicon-PDMS-Water-Platinum (Electrode)-MaskStep 7: Mask 4. Deposit SiNStep 8: Fill with Liquid (Water) Final Step: Deposit Thin Film PDMS (Flexible Layer)2Design challenges, concerns, and comments- Dimensions are not specified- Sealing. How to prevent leaking - Difficult to remove bubble quickly- Extremely low power as well as proportional control.
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