Recitation 1 Review of IC Technology 6.012 Spring 2009 Recitation 1: IC TechnologyHow are integrated circuits being designed and fabricated?1. IC Design: application circuits design: design tools include layout, place and→→route, circuit simulation, etc2. Fabrication and Integration:(a) What material that allows the development of microelectronics? a class of ma-terials called “semiconductors”• two types of “carriers” - electron and hole (the missing of an electron)• carrier concentrations can be controlled over many orders of magnitude bydoping and electric field effects.Examples of semiconductors: GaAs, GaN, Si, Ge. This class will focus on Si.(b) How to make Si wafers (from sand, crystal growth . . . ?)(c) Fabrication• Defining area: “Lithography” (mostly in industry - photolithography)• Cutting out material = “etching” (wet vs. dry)• Insulation= SiO 2 (oxide) or Si 3N 4 (nitride), oxidation or nitride deposi-tion• Tuning conductivity (carrier concentration) = doping (ion implantation)• Metallic wiring (interconnect): Al now Cu• Chemical-mechanical polishing (CMP)(d) The heart of microelectronicsFigure 1: The Transistor1MIT OpenCourseWarehttp://ocw.mit.edu 6.012 Microelectronic Devices and CircuitsSpring 2009 For information about citing these materials or our Terms of Use, visit:
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