EE 201A/EE298 Modeling and Optimization for VLSI LayoutOutlineInstructor InfoAbout this CourseCourse PrerequisitesEE205A and EE205BVLSI Design CycleVLSI Design Cycle (cont.)Simplified Physical Design CycleCourse Outline and ScheduleRelated VLSI CAD ConferencesRelated VLSI CAD JournalsMoney Talk for VLSI CADReferences for this CourseGrading PolicyCourse Presentation (15%)Term Project (50%)Who should take this courseComplexities of Physical DesignMoore’s Law and NTRSProductivity GapDesign Challenges in Nanometer TechnologiesDesign StylesFull Custom Design StyleStandard Cell Design StyleGate Array Design Style (or Structured ASIC)Field-Programmable Gate-Arrays (FPGAs)FPGA Design StyleComparisons of Design StylesSlide 30Packaging StylesPrinted Circuit Board ModelMCM ModelWafer Scale IntegrationComparisons of Packaging StylesIncreasingly on the Same Chip or in the Same Package (SoC and SiP)History of VLSI Layout ToolsSummaryHomework (due April 14th)EE 201A/EE298Modeling and Optimization for VLSI Layout Instructor: Lei HeEmail: [email protected]Course logisticsCourse logisticsOverviewOverviewWhat are covered in the courseWhat are covered in the courseWhat are interesting trends for physical designWhat are interesting trends for physical designInstructor InfoEmail: [email protected]: [email protected]Phone: 310-206-2037Phone: 310-206-2037Office: Engineering IV 68-117Office: Engineering IV 68-117Office hours: Tu/Th 2-3pm or by Office hours: Tu/Th 2-3pm or by appointmentappointmentThe best way to reach me: The best way to reach me: Email with EE201 in subject lineEmail with EE201 in subject lineAbout this CourseOne of selective course for EE’s ECS Major Field StudentsOne of selective course for EE’s ECS Major Field StudentsQuestion in M.S. comprehensive exam / PhD prelimsQuestion in M.S. comprehensive exam / PhD prelimsOffered every other springOffered every other springWill be under another course number (EE205B)Will be under another course number (EE205B)Related coursesRelated coursesMani’s EE202A Embedded Computing Systems (Fall)Mani’s EE202A Embedded Computing Systems (Fall)Ingrid’s EE201A on Advanced VLSI (Spring)Ingrid’s EE201A on Advanced VLSI (Spring)Bill M-S’s EE204A on Compilers (Winter)Bill M-S’s EE204A on Compilers (Winter)My EE205A Fundamental to CAD (Winter)My EE205A Fundamental to CAD (Winter)Mani’s EE206A Wireless Systems (Spring)Mani’s EE206A Wireless Systems (Spring)My EE205B (every other Spring)My EE205B (every other Spring)Course PrerequisitesOfficial prerequisiteOfficial prerequisiteEE116BEE116B VLSI System DesignVLSI System DesignBut mainly self-containedBut mainly self-containedKnowledge to help you appreciate moreKnowledge to help you appreciate moreCS180CS180Introduction to algorithmsIntroduction to algorithmsEE205A and EE205BEE205A Fundamental to CAD of embedded systemsEE205A Fundamental to CAD of embedded systemsSystem level performance/power/thermal modeling and System level performance/power/thermal modeling and optimizationoptimizationSynthesis – scheduling and allocation, logic optimization Synthesis – scheduling and allocation, logic optimization and technology mappingand technology mappingFPGA circuits and architectures and placement and FPGA circuits and architectures and placement and routing for FPGArouting for FPGAEE205B Modeling and Optimization for VLSI layoutEE205B Modeling and Optimization for VLSI layoutAdvanced algorithms for physical designAdvanced algorithms for physical designFundamentals of combinatorial algorithmFundamentals of combinatorial algorithmDetailed performance, signal integrity, power and thermal Detailed performance, signal integrity, power and thermal modelsmodelsIncorporating physical design into system designIncorporating physical design into system designSystem SpecificationFunctional DesignLogic DesignCircuit DesignX=(AB*CD)+(A+D)+(A(B+C))Y=(A(B+C))+AC+D+A(BC+D))VLSI Design CyclePhysical DesignFabricationPackagingVLSI Design Cycle (cont.)PartitionFloorplanningPlacementSimplified Physical Design CycleRoutingExtraction and VerificationFront-endFront-endphysical designphysical designBack-endBack-endphysical designphysical designCourse Outline and ScheduleFront-end physical design (4.5 weeks)Front-end physical design (4.5 weeks)Partitioning, floorplanning and placementPartitioning, floorplanning and placementPower and thermal modelingPower and thermal modelingAlgorithms: divided and conquer, simulated annealing, genetic algorithmAlgorithms: divided and conquer, simulated annealing, genetic algorithmProject proposal due by end of fifth weekProject proposal due by end of fifth weekBack-end physical design (4.5 weeks)Back-end physical design (4.5 weeks)Interconnect extraction and modeling Interconnect extraction and modeling Interconnect synthesisInterconnect synthesisNoise modeling and avoidanceNoise modeling and avoidanceClock and power supply design **Clock and power supply design **Algorithms: dynamic programming, linear programmingAlgorithms: dynamic programming, linear programmingProject report due the last day of the quarterProject report due the last day of the quarter ACM IEEE Design Automation Conference (DAC) http://www.dac.com (San Diego, Young student program) International Conference on Computer Aided Design(ICCAD) Design, Automation and Test in Europe (DATE) Asia and South Pacific Design Automation Conference (ASP-DAC) International symposium on physical design (ISPD) International symposium on low power electronics and design International symposium on field programmable gate array IEEE International Symposium on Circuits and Systems (ISCAS)Related VLSI CAD Conferences IEEE Transactions on CAD of Circuits and systems (TCAD) ACM Trans. on Design Automation of Electronic Systems (TODAES) IEEE Transactions on Circuits and Systems (TCAS) IEEE Trans. on VLSI Systems (TVLSI) IEEE Trans. on Computer Integration Algorithmica SIAM journal of Discrete and Applied MathematicsRelated VLSI CAD Journals Synposys, Cadence, Magma, Mentor Graphics, … Over hundreds companies have booths at DAC Two of them are among the ten biggest software companies in the worldBut they are smaller than the biggest spin-off of EDA EDA is regarded as A-graded bonds for Venture
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