DETERMINING THE COEFFICIENT OF THERMAL EXPANSION




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DETERMINING THE COEFFICIENT OF THERMAL EXPANSION OF PRINTED WIRING BOARD COMPONENTS by Tong Wa Chao TC 660H Plan II Honors Program The University of Texas at Austin May 1998 DETERMINING THE COEFFICIENT OF THERMAL EXPANSION OF PRINTED WIRING BOARD COMPONENTS by Tong Wa Chao TC 660H Plan II Honors Program The University of Texas at Austin May 1998 Kenneth M Liechti Ph D Department of Aerospace Engineering and Engineering Mechanics Supervising Professor Mark E Mear Ph D Department of Aerospace Engineering and Engineering Mechanics Second Reader ABSTRACT The integrity and reliability of multi layer electronic boards depend on the strength and quality of the bond between the layers High temperature circuit integration processes such as soldering that exceed the glass transition temperature Tg of the polymeric components and pre existing flaws such as cracks voids and areas of poor adhesion can produce delaminations whose growth can cause device failures Delamination s negative effects on manufacturing yield make it important to understand how it occurs and characterize the resistance to delamination However before fracture experiments on a Printed Wiring Board material can be performed it is necessary to establish the material s thermomechanical properties This work sought to achieve part of this objective through determining the coefficient of thermal expansion of Printing Wiring Board Components The challenges arose from accurately measuring both the milli inch level displacements and the changing temperatures in the measuring frame which had a large thermal mass compared to the specimen ACKNOWLEDGEMENTS I would like to gratefully acknowledge my thesis advisor Professor Kenneth Liechti for his guidance and support throughout this project and for providing me many other valuable research opportunities that have enriched my undergraduate career I would also like to thank Professor Mark Mear my undergraduate advisor for reviewing this thesis More than that I would like to






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