1.0 Introduction1.1 Motivation1.2 Background1.3 Objectives1.4 Literature Review1.4.1 Vitreous Silica dilatometers1.4.2 Twin-telemicroscope method1.4.3 Interferometers1.4.4 Thermomechanical analyzers2.0 Description of Specimens2.1 Fused Silica2.2 Printed Wiring Board3.0 Experiments3.1 Rationale for Choosing this Approach3.2 Experimental Approach3.3 Displacement Transducer Description3.4 Experimental Set-Up3.5 Test Procedure3.6 Data Reduction4.0 Discussion of Results5.0 ConclusionsTablesFiguresReferencesAppendixA1 Error AnalysisA2 Raw DataA3 Equipment ListDETERMINING THE COEFFICIENT OF THERMAL EXPANSION OF PRINTED WIRING BOARD COMPONENTS by Tong Wa Chao TC 660H Plan II Honors Program The University of Texas at Austin May, 1998DETERMINING THE COEFFICIENT OF THERMAL EXPANSION OF PRINTED WIRING BOARD COMPONENTS by Tong Wa Chao TC 660H Plan II Honors Program The University of Texas at Austin May, 1998 Kenneth M. Liechti, Ph.D. Department of Aerospace Engineering and Engineering Mechanics Supervising Professor Mark E. Mear, Ph.D. Department of Aerospace Engineering and Engineering Mechanics Second ReaderABSTRACT The integrity and reliability of multi-layer electronic boards depend on the strength and quality of the bond between the layers. High temperature circuit integration processes (such as soldering) that exceed the glass transition temperature, Tg, of the polymeric components and pre-existing flaws such as cracks, voids, and areas of poor adhesion can produce delaminations whose growth can cause device failures. Delamination’s negative effects on manufacturing yield make it important to understand how it occurs and characterize the resistance to delamination. However, before fracture experiments on a Printed Wiring Board material can be performed, it is necessary to establish the material’s thermomechanical properties. This work sought to achieve part of this objective through determining the coefficient of thermal expansion of Printing Wiring Board Components. The challenges arose from accurately measuring both the milli-inch-level displacements and the changing temperatures in the measuring frame, which had a large thermal mass compared to the specimen.ACKNOWLEDGEMENTS I would like to gratefully acknowledge my thesis advisor, Professor Kenneth Liechti, for his guidance and support throughout this project and for providing me many other valuable research opportunities that have enriched my undergraduate career. I would also like to thank Professor Mark Mear, my undergraduate advisor, for reviewing this thesis. More than that, I would like to thank him for offering me wise counsel during my four years as an undergraduate. I am grateful to Plan II for giving me the primary motivation to take on this rewarding endeavor. Among the graduate students who worked in the basement labs at the WRW building, I would like to thank especially Greg Swadener and Alex Arzoumanidis for their lab equipment tutorial and technical support. I would also like to thank Patrick Klein for his opinions. I would like to thank my parents, Chao Wa and Ho Heong-Peng, and my sister, Chao San-San, for their ongoing encouragement and emotional support. Lastly but certainly not the least, I would like to thank Louisa for giving me happiness.TABLE OF CONTENTS 1.0 INTRODUCTION.................................................................................................................................. 1 1.1 MOTIVATION........................................................................................................................................... 1 1.2 BACKGROUND ........................................................................................................................................ 1 1.3 OBJECTIVES............................................................................................................................................ 2 1.4 LITERATURE REVIEW............................................................................................................................... 2 1.4.1 Vitreous Silica dilatometers........................................................................................................... 2 1.4.2 Twin-telemicroscope method......................................................................................................... 3 1.4.3 Interferometers .............................................................................................................................. 3 1.4.4 Thermomechanical analyzers........................................................................................................ 4 2.0 DESCRIPTION OF SPECIMENS........................................................................................................ 5 2.1 FUSED SILICA......................................................................................................................................... 5 2.2 PRINTED WIRING BOARD ........................................................................................................................ 5 3.0 EXPERIMENTS..................................................................................................................................... 7 3.1 RATIONALE FOR CHOOSING THIS APPROACH ........................................................................................... 7 3.2 EXPERIMENTAL APPROACH ..................................................................................................................... 7 3.3 DISPLACEMENT TRANSDUCER DESCRIPTION............................................................................................ 8 3.4 EXPERIMENTAL SET-UP .......................................................................................................................... 9 3.5 TEST PROCEDURE................................................................................................................................... 9 3.6 DATA REDUCTION ................................................................................................................................ 11 4.0 DISCUSSION OF RESULTS.............................................................................................................. 13 5.0 CONCLUSIONS................................................................................................................................... 15