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UMD ENMA 490 - MICROCHANNEL DESIGN ISSUES

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MICROCHANNEL DESIGN ISSUESPRELIMINARY OUTLINEASSUMPTIONS/ CONTROL LEVELGENERAL FUNCTIONS/CONSTRAINTSGENERAL FUNCTIONS/CONSTRAINTSPOTENTIAL PROBLEMSMajor Device Fabrication AlternativesPredominate Bio-Micro Fluidics MaterialsMask Design for MoldsSlide 10Mask DesignMask DimensionsMICROCHANNEL DESIGN ISSUESMICROCHANNEL DESIGN ISSUESSusan BeattyAnne SamuelKunal ThakerPRELIMINARY OUTLINEPRELIMINARY OUTLINEAssumptionsControl Level of DesignGeneral Functions/ ConstraintsProblemsDevice FabricationMaterialsASSUMPTIONS/ CONTROL LEVELASSUMPTIONS/ CONTROL LEVELAssume externally pumped fluid flow–No need to design on-chip pumping Neglect the bio-chemistry at the test sites–Only consider how the fluid is to be transportedMust incorporate multi-level microfluidic channelsControl Level–Passive Microfluidics (Simple channels)–Active Microfluidics (Channels + Active control devices to manipulate fluid flow through numerous possible paths)GENERAL FUNCTIONS/CONSTRAINTSGENERAL FUNCTIONS/CONSTRAINTSA problem and/or functions of a design must be established prior to the consideration of a possible final design–Two possible problems have been defined which incorporate the required assumptionsControllably route each of three input lines to any one of eight different test sites (located on two levels of microchanneling) –Requires multi-level micro fluidics–Requires controllable microfluidics (must be able to control which Input line is fed to which of the eight test sites)GENERAL FUNCTIONS/CONSTRAINTSGENERAL FUNCTIONS/CONSTRAINTSRoute each of threeInputs(R,B,Y) to output each to two outputs original color will mix with one other color to create secondary colorsPOTENTIAL PROBLEMSPOTENTIAL PROBLEMSJunction–On/ off valve–1 or 2 devicesActuation–Electric–Pressure–Pressure and ElectricGeometry of the junctionMajor Device Fabrication AlternativesMajor Device Fabrication AlternativesSurface Micromachining–Standard deposition and etching techniques to remove only a small fraction of the wafer volume–Potential for use of sacrificial layers in sequential SU8 depositionBulk Micromachining–Removing bulk section of a wafer–Typically followed by wafer bonding for micro fluidics applicationsMold–Use of a mold, on which multiple polymer layers can be cured and sequentially layeredPredominate Bio-Micro Fluidics MaterialsPredominate Bio-Micro Fluidics MaterialsPDMS-PolydimethylsiloxanePMMA-PolymethylmethacrylateSU8  Pyrex GlassSiliconMask Design for MoldsMask Design for MoldsSpin SU8(negative resist) on Si wafersExpose using mask (channel mask and interconnect mask)Develop both moldsMask Design for MoldsMask Design for MoldsSpin SU8(negative resist) on Si wafersExpose using mask (channel mask and interconnect mask)Develop both moldsBottom layerMiddle layertop layerI/OI/OMask DesignMask DesignFrom molds spin on PDMS less than the vertical dimensionFrom channel mold make two layersFrom interconnect mold make one layerStack three layers in channel, interconnect, channel (90o rotation from first channel layer) orderMask DimensionsMask DimensionsFor initial preliminary fabrication larger dimensions are betterApproximate channel and interconnect width 150 mChannel length 45mmReservoirs 300m diameter (total length channel and reservoir 45.6mmDistance between channels 300mMold feature height


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UMD ENMA 490 - MICROCHANNEL DESIGN ISSUES

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