Eastfield College Career Technologies Division Instructor: Clay Rawlins Contact Information: Office: L101 Phone: 972-860-7683 Email address: [email protected] Hours Available: Posted Office Hours & by Appointment Course Description Textbooks and Other Course Materials: Spring 2012 High-Reliability Soldering CETT 1204 Section 4001 2 Credit Hours Lecture TBA TBA Room L102 Lab TBA TBA Room L102 CETT 1204 High-Reliability Soldering (2) This is a WECM Course Number. Instruction in this course will teach high reliability soldering, desoldering, circuitry repair, plated-thru-hole repairs, conformal coating removal, industry standards, electrostatic discharge (ESD) control, surface mount device (SMD) installation, removal and replacement using hand held systems or reflow workstations. Students will solder highly reliable connections; solder to industry standards; desolder connections; install surface mount devices; remove surface mount devices; remove conformal coatings; repair and/or replace traces, pads, and eyelets. (1 Lec., 2 Lab.) PC015 Eastfield Soldering Kit (Available in Campus Bookstore)2 Developmental Courses Course Objectives: The Texas Success Initiative (TSI) is a statewide program designed to ensure that students enrolled in Texas public colleges and universities have the basic academic skills needed to be successful in college-level course work. The TSI requires assessment, remediation (if necessary), and advising of students who attend a public college or university in the state of Texas. The program assesses a student’s basic academic skills in reading, writing, and math. Passing the assessment is a prerequisite for enrollment in many college-level classes such as English 1301/1302, History 1301/1302, Math 1414, etc. Students who do not meet assessment standards may complete prerequisite requirements by taking developmental courses in the deficient area and passing them with a grade of C or higher. In some cases retesting will also be required. It is up to each student to be aware and informed about requirements that are subject to change. Additional information is available from the TSI Office. https://www1.dcccd.edu/cat0910/admiss/tsi.cfm?loc=4 The purpose of this course is to provide the student with a thorough knowledge of the theory and application of surface mount soldering as related to the following areas: 1. Surface Mount Assemblies 2. Identification of Surface Mount Components 3. Purpose and Use of Flux 4. Purpose and Use of different types of Solder & Solder Paste 5. Identify Appropriate Precautions when Soldering 6. Explore different heating methods for Surface Mount Soldering 7. Identify Effects & Methods of Prevention of Oxidation 8. Chip Components Rework 9. Gull Wing Components Rework 10. J-Lead Rework Students will be provided with the facilities, equipment, instruction, and assignments necessary to enable them to accomplish the course objectives. End-of-Course Outcomes: Solder highly reliable connections; solder to industry standards; desolder connections; install surface mount devices; remove surface mount devices; Student Learning Outcomes: Students will solder and remove through-hole and surface-mount components from a PC board.3 Evaluation Procedures: Obtaining Final Course Grades Using eConnect Final Grade Reports are no longer mailed. Convenient access is available online at www.econnect.dcccd.edu. Use your identification number when you log onto eConnect, an online system developed by the DCCCD to provide you with timely information regarding your college record. Your grades will also be printed on your Student Advising Report, which is available in the Admissions Office. Eastfield College Email Policy Faculty and students must have and use a DCCCD account for all correspondence relating to academic coursework. For information on setting up a DCCCD student email account go to: http://www.dcccd.edu/netmail/home.html All Videos (VT-91 to VT-94) must be viewed and Quizzes 1 through 6 must be completed. All component installations, removals and preparations must be completed and all work must be inspected by the course instructor of record. All work must be performed such that it meets as close to IPC-A-610 and ANSI/J-STD-001 standards as possible. The relative weight of each of the grading components of the course is outlined below: Quizzes (weighted equally) 40 % Lab Procedures (weighted equally) 60 % The course grade will be calculated as follows: Quiz 1 + Quiz 2 + ...+ Quiz5 Quiz Average = -------------------------------------- 5 Proc. 1 + Proc. 2 + ... + Proc. 8 Procedure Average = --------------------------------------- 8 Course Average = (0.4 x Quiz Avg.) + (0.6 x Procedure Avg.)4 Course Outline: WEEK DATE TOPIC 1 1-16 Course Orientation 2 1-23 View VT-91 Take Quiz 1 3 1-30 View VT-92 Part I Take Quiz 2 4 2-6 Install through hole components R1 to R6, C1 to C6, Q1 to Q1 to Q9 & U1 to U3 5 2-13 View VT-92 Part II Take Quiz 3 6 2-20 Install 1st half of Chip Components D1 to D6 & R7 to R12 7 2-27 Install 2nd half of Chip Components C7 to C12 & C13 to C18 8 3-5 View VT-93 Take Quiz 4 3-12 Spring Break 9 3-19 Install Gull-Wing Components Q10 to Q15 & U4 to U11 10 3-26 View VT-94 Part I 11 4-2 View VT-94 Part II Take Quiz 5 12 4-9 Install J-Lead Components U12 to U15 Submit fully populated board for assessment prior to removal of any components. 13 4-16 Remove half of Chip and Gull-Wing Components 14 4-23 Remove half of J-Lead Components 15 4-30 Remove half of Thru-Hole Components 16 5-7 Submit Board for Final Evaluation5 Attendance Policy: Financial Aid Statement Students who are receiving any form of financial aid should check with the Financial Aid Office prior to